Product Category
SVE — 001 to 018
Semiconductor
& Vacuum
Equipment Parts
18 precision machined product lines for semiconductor fabrication equipment, vacuum systems, and ultra-clean process environments — from UHV chamber bodies and wafer-handling fixtures to gas distribution plates, ceramic-to-metal assemblies, and ESD-safe tooling.
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10⁻⁹ mbar·l/s
Helium Leak Rate
📐
±0.003 mm
Sealing Face Flatness
✦
Ra ≤0.25 μm
Electropolished EP
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Clean-Room
Packaging & Delivery
18
Product Lines
Vacuum chambers to ESD fixtures — complete equipment build support
10⁻⁹ mbar·l/s
Leak Rate
He mass-spectrometer leak test on all vacuum parts, cert included
316L EP
Process Gas Grade
Electropolished SS316L for all corrosive gas-wetted surfaces
24 hr
Quote Turnaround
DFM feedback and full quotation within 24 hours of drawing receipt
18
Product Lines
10⁻⁹ mbar·l/s
He Leak Rate
Ra ≤0.25μm
EP Surface
±0.003mm
Sealing Flatness
24 hr
Quote Turnaround
Vacuum Chamber Bodies ✦
Chamber Cover Plates ✦
Chamber Sealing Frames ✦
Chamber Internal Components ✦
Wafer Handling Fixtures ✦
Wafer Alignment Parts ✦
Equipment Mounting Plates ✦
Insulating Support Parts ✦
ESD Anti-Static Fixtures ✦
Precision Guide Components ✦
Gas Distribution Plates ✦
Vacuum Flange Adapters ✦
High-Cleanliness Structures ✦
Pump-Valve Transition Fittings ✦
Chamber Viewport Frames ✦
High-Flatness Mounting Bases ✦
Ceramic / PEEK Metal Seat Assemblies ✦
Equipment End-Effector Parts ✦
Vacuum Chamber Bodies ✦
Chamber Cover Plates ✦
Chamber Sealing Frames ✦
Chamber Internal Components ✦
Wafer Handling Fixtures ✦
Wafer Alignment Parts ✦
Equipment Mounting Plates ✦
Insulating Support Parts ✦
ESD Anti-Static Fixtures ✦
Precision Guide Components ✦
Gas Distribution Plates ✦
Vacuum Flange Adapters ✦
High-Cleanliness Structures ✦
Pump-Valve Transition Fittings ✦
Chamber Viewport Frames ✦
High-Flatness Mounting Bases ✦
Ceramic / PEEK Metal Seat Assemblies ✦
Equipment End-Effector Parts ✦
Full Product Range
18 Semiconductor & Vacuum Equipment
Product Lines
Select a category on the left to view products · All parts to drawing · MOQ 1 piece · He leak test included
Product Categories
Vacuum Chambers & Sealing
4
Wafer Handling & Alignment
2
Equipment Mounting & Support
3
Gas, Flange & Fluid Interface
4
Specialist & Composite Parts
5
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Vacuum Chambers & Sealing
UHV-compatible chamber bodies, sealing frames, cover plates, and internal structural components. All wetted surfaces electropolished to Ra ≤0.4 μm or better. Conflat, ISO-KF, and ISO-K flange standards. Every chamber helium leak tested to 10⁻⁹ mbar·l/s before shipment.
Materials: SS316L EP · Al6061 · OFHC Copper · Titanium
SVE-001
VACUUM CHAMBERS / 001 — FEATURED
Vacuum Chamber Bodies
UHV-compatible chamber bodies in SS316L — machined from solid billet or rolled and welded plate, then electropolished internally. Multiple Conflat or ISO-K flange ports positioned and bored on CNC horizontal machining center. Internal surface Ra ≤0.4 μm after EP; ≤0.25 μm on request. Helium leak tested to 10⁻⁹ mbar·l/s. From small analysis chambers to large deposition reactor bodies.
SS316L · Al6061 · OFHC Cu
Get Quote
SVE-002
VACUUM CHAMBERS / 002
Chamber Cover Plates
Vacuum chamber cover and access plates with O-ring groove or knife-edge metal seal face. Sealing face flatness ±0.003 mm. Through-holes for feedthroughs positioned by CNC. Electropolished internal face.
SS316L · Al6061 · TiGet Quote/div>
SVE-003
VACUUM CHAMBERS / 003
Chamber Sealing Frames
Precision sealing ring frames and gasket-seat bodies for chamber mating faces. Knife-edge Conflat-style sealing frames with face-to-face parallelism ≤0.005 mm. Supplied matched to chamber body or as standalone.
SS316L · OFHC Cu · InconelGet Quote/div>
SVE-004
VACUUM CHAMBERS / 004
Chamber Internal Components
Shields, baffles, electrode supports, stage brackets, and sample holders that live inside vacuum chambers. Low outgassing material selection. All blind holes counter-bored to prevent gas trapping. Electropolished or bead-blasted.
SS316L · Al · Ti · MacorGet Quote
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Wafer Handling & Alignment
Wafer handling clamp rings, end-effectors, and alignment edge-locating components for wafer transport, load-lock stages, and process chambers. ESD-safe materials and PEEK/ceramic contact surfaces prevent electrostatic damage and metal contamination.
Materials: Al6061 · PEEK · Ceramic · SS316L · Delrin
SVE-005
WAFER HANDLING / 005 — FEATURED
Wafer Handling Clamp Fixtures
Wafer clamp rings, fork end-effectors, and gripper assemblies for 200 mm and 300 mm wafer transport in atmospheric and vacuum environments. Contact surfaces in PEEK or ceramic (Al₂O₃) to prevent metal contamination. ESD-safe versions with carbon-loaded PEEK or conductive Al for electrostatic discharge protection. Wafer contact position tolerance ±0.05 mm. Vacuum-compatible outgassing characterisation available.
Al6061 · PEEK · Al₂O₃ · C-PEEKGet Quote
SVE-006
WAFER HANDLING / 006
Wafer Alignment & Locating Parts
Precision wafer edge-locating pins, flat-finder notch sensors, and alignment stage inserts. Position tolerance ±0.01 mm. Hard-anodized aluminium or ceramic pin materials for long wear life without contamination.
Al7075 · Al₂O₃ · ZrO₂ · SSGet Quote
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Equipment Mounting & Support
Semiconductor equipment mounting plates, insulating support structures, ESD-safe fixtures, and precision linear guides used in the structural and motion subassemblies of process equipment. High flatness, tight positional tolerances, and non-contaminating materials throughout.
Materials: Al6061 · Al7075 · PEEK · Al₂O₃ · SS316L
SVE-007
MOUNTING & SUPPORT / 007 — FEATURED
Equipment Mounting Plates
High-flatness equipment mounting and adapter plates for semiconductor process tools — connecting robot arms, stage assemblies, and sensor modules to equipment frames. Flatness ±0.005 mm across the mounting face; positional tolerance on mounting hole patterns ±0.008 mm. Stress-relieved Al6061-T651 plate stock as standard — eliminates post-machining distortion. Hard-anodized Type III for surface protection. Supplied with CMM dimensional report.
Al6061-T651 · Al7075 · SS316LGet Quote
SVE-008
MOUNTING & SUPPORT / 008
Insulating Support Parts
Electrical isolators, stand-off supports, and bushing insulators in PEEK, Al₂O₃ ceramic, or Macor machinable glass ceramic. Separate electrically active components from ground in RF and plasma chambers. Volume resistivity >10¹⁴ Ω·cm.
PEEK · Al₂O₃ · Macor · PTFEGet Quote
SVE-009
MOUNTING & SUPPORT / 009
ESD Anti-Static Fixtures
ESD-safe tool holders, component trays, and assembly jigs in carbon-loaded PEEK (C-PEEK), ESD-safe aluminium, or static-dissipative nylon. Surface resistivity 10⁶–10⁹ Ω/sq for controlled charge dissipation without discharge.
C-PEEK · ESD Al · ESD NylonGet Quote
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Gas, Flange & Fluid Interface
Gas distribution plates, vacuum flange adapters, pump-to-valve transition fittings, and chamber viewport frames. All gas-wetted surfaces in electropolished 316L. Flanges machined to Conflat, KF, and ISO-K standards. Helium leak tested. Clean-room packaged.
Materials: SS316L EP · Al6061 · OFHC Cu · Borosilicate
SVE-011
GAS & FLANGE / 011 — FEATURED
Gas Distribution Plates (Showerheads)
Precision showerhead gas distribution plates for CVD, ALD, PECVD, and etch chambers. Uniform orifice array with diameter uniformity ±0.005 mm across the plate. Electropolished 316L Ra ≤0.25 μm. Helium leak test 10⁻⁹ mbar·l/s on every plate. Compatible with F₂, NF₃, Cl₂, HCl, and other corrosive process gases. Single-zone and dual-zone gas delivery configurations. Clean-room packaged under nitrogen purge.
SS316L EP · Hastelloy · Inconel · AlGet Quote
SVE-012
GAS & FLANGE / 012
Vacuum Flange Adapter Parts
Conflat-to-KF, ISO-K-to-Conflat, and non-standard vacuum flange adapters with matched sealing faces. Knife-edge parallelism ≤0.005 mm. Electropolished internals. He leak tested as assembled.
SS316L · OFHC CuGet Quote
SVE-013
GAS & FLANGE / 013
Pump-Valve Transition Fittings
Custom transition couplings between vacuum pumps (ISO-K or flanged), gate valves, and chamber bodies. Non-standard bolt patterns and cross-over geometries machined from solid billet. All wetted surfaces electropolished.
SS316L · Al6061Get Quote
SVE-014
GAS & FLANGE / 014
Chamber Viewport Frames
Viewport window flanges and frames for borosilicate, sapphire, or fused silica windows. Glass-to-metal sealing groove machined to specified glass OD with ±0.02 mm fit tolerance. Electropolished SS316L standard.
SS316L · Kovar · CuGet Quote
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Specialist & Composite Parts
High-cleanliness structural components, high-flatness equipment bases, precision guide parts, ceramic-to-metal assemblies, and equipment end-effector components. Complex material combinations and highest-cleanliness applications within semiconductor fab environments.
Materials: Al6061 · SS316L · PEEK · Al₂O₃ · SiC · Invar
SVE-010
SPECIALIST / 010
Precision Guide Components
Linear guide rails, dovetail slide components, and track sections for equipment motion stages in clean and vacuum environments. Surface hardness and geometric precision maintained after hard-anodize or electroless-nickel surface treatment.
Al7075 · SS440C · TiGet Quote
SVE-015
SPECIALIST / 015
High-Cleanliness Structural Parts
Equipment frame members, support brackets, and structural nodes machined and cleaned to ISO Class 5 (Class 100) requirements. All surfaces passivated, electropolished, or anodized. Clean-room packaged after final inspection. No bare aluminium exposed surfaces.
Al6061 · SS316L · TiGet Quote
SVE-017
SPECIALIST / 017 — FEATURED
Ceramic & PEEK to Metal Seat Assemblies
Composite assemblies combining ceramic (Al₂O₃, SiC, ZrO₂) or PEEK insulating components with precision-machined metal (SS316L or Ti) housings, seat rings, and retention frames. Metal seats machined to H7/H6 fit tolerance for ceramic insert press-fit. Electrical isolation verified after assembly. Applications include RF electrode insulator assemblies, plasma containment rings with metal mounting frames, and dielectric window retainer assemblies.
SS316L + Al₂O₃ · Ti + SiC · Al + PEEKGet Quote
SVE-016
SPECIALIST / 016
High-Flatness Equipment Mounting Bases
Large precision equipment bases and reference plates. Flatness ±0.003 mm on top surface after stress relief and precision grinding. Invar or stress-relieved Al6061-T651 for thermal stability. Used as reference datum for equipment calibration and alignment.
Al6061-T651 · Invar36 · SSGet Quote
SVE-018
SPECIALIST / 018
Equipment End-Effector Parts
Actuator tips, gripper fingers, blade end-effectors, and sensor mount arms for semiconductor automation equipment. Low mass, high stiffness. PEEK or ceramic contact zones. ESD-safe versions available. Position repeatability machined to ±0.02 mm.
Al · PEEK · Ceramic · TiGet Quote
Manufacturing Capability
What Semiconductor Equipment Parts
Demand from a Machining Partner
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Helium Mass-Spectrometer Leak Testing
Every vacuum component tested with a helium mass-spectrometer leak detector — not just visually inspected or pressure-tested. Standard leak rate 10⁻⁸ mbar·l/s; 10⁻⁹ for UHV and process gas components. Individual serialised test certificate with every part. Not an optional add-on — included in base price for all vacuum parts.
10⁻⁸ standard
10⁻⁹ UHV
Individual cert
✦
Electropolishing & Process Gas Compatibility
316L SS internal surfaces electropolished to Ra ≤0.25 μm. EP removes embedded particles, reduces outgassing, and creates a Cr-rich passive layer resistant to corrosive process gases (F₂, NF₃, Cl₂, HCl). Passivation per ASTM A967 for all SS parts. PFA or PVDF lining available for highest chemical resistance requirements.
Ra ≤0.25 μm EP
ASTM A967 Passivation
F₂/NF₃/Cl₂ Compatible
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Clean-Room Cleaning & Packaging
All semiconductor parts cleaned in ISO Class 5 (Class 100) clean-room environment after final machining and surface treatment. Ultrasonic cleaning in deionised water, IPA rinse, and nitrogen blow-dry. Double-bagged in ESD-safe film under nitrogen purge. Particle count certification available for process gas and vacuum-wetted parts.
ISO Class 5
DI Water / IPA Rinse
N₂-purge Double-Bag
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ESD-Safe Materials & Handling
Carbon-loaded PEEK (C-PEEK), ESD-safe aluminium, and static-dissipative nylon for all fixtures and handling components. Surface resistivity measured and documented — 10⁶–10⁹ Ω/sq for controlled dissipation. ESD wrist strap mandatory throughout machining and packaging. Handling fixtures grounded during final assembly inspection.
C-PEEK / ESD Al
10⁶–10⁹ Ω/sq
Resistivity Certified
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Ceramic Machining & Ceramic-to-Metal Assembly
Al₂O₃, SiC, ZrO₂, and Macor machinable ceramic machined to drawing with diamond tooling. Precision bore fits in metal housings for ceramic insert press-fit — H7/H6 tolerance. Electrical isolation of assembled parts verified by insulation resistance measurement. Matched ceramic-to-metal assemblies supplied and tested as complete units.
Al₂O₃ / SiC / ZrO₂
H7/H6 Press-Fit
Isolation Verified
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High-Flatness & Conformal Contact Surfaces
Sealing faces and equipment datum surfaces ground or lapped to ±0.003 mm flatness. Mounting base plates in stress-relieved Al6061-T651 or Invar for thermal stability. CMM verified after all surface treatments. Critical for wafer stage reference accuracy and vacuum seal integrity across thermal cycling.
±0.003mm flatness
T651 / Invar stock
CMM after treatment
Precision Specifications
Tolerances & Test Standards — Semiconductor & Vacuum Parts
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Dimensional Tolerances by Feature
| Sealing Face Flatness | ±0.003 mm (ground / lapped) |
| Mounting Plate Flatness | ±0.005 mm (stress-relieved + ground) |
| Flange Knife-Edge Parallelism | ≤0.005 mm |
| Vacuum Port Position | ±0.05 mm (multi-port chambers) |
| Wafer Contact Position | ±0.05 mm |
| Orifice Diameter (Gas Plate) | ±0.005 mm |
| Ceramic-to-Metal Press Fit | H7 / H6 bore tolerance |
| General Bore / OD | ±0.005 mm standard |
He Leak Rate (Standard)
10⁻⁸ mbar·l/s
All vacuum chamber bodies, cover plates, and sealing frames. Mass-spectrometer tested.
He Leak Rate (UHV / Gas Plate)
10⁻⁹ mbar·l/s
Gas distribution plates, process gas wetted manifolds, and UHV chamber bodies.
EP Surface Finish
Ra ≤0.25 μm
SS316L internal wetted surfaces after electropolishing. Ra ≤0.4 μm standard EP.
ESD Surface Resistivity
10⁶–10⁹ Ω/sq
C-PEEK and ESD Al fixtures. Measured and documented per IEC 61340-5-1.
Insulation Resistance
>10¹⁴ Ω·cm
PEEK and Al₂O₃ insulator volume resistivity. Verified on ceramic-to-metal assemblies.
Clean-Room Class
ISO 5
Cleaning and packaging environment. ISO 14644-1 Class 5 (Class 100 equivalent).
Material Selection
Key Materials for Semiconductor & Vacuum Applications
SS316L Electropolished
Workhorse material for all vacuum and semiconductor gas-wetted surfaces. 316L (low carbon) minimises carbide precipitation at welded joints. Electropolishing removes embedded iron and surface roughness — critical for particle reduction and process gas compatibility.
Tensile Strength
485 MPa
EP Surface Ra
≤0.25 μm (≤0.4 μm standard EP)
He Leak Test
10⁻⁹ mbar·l/s achievable
Gas Compatibility
F₂, NF₃, Cl₂, HCl — with EP passivation
Standard
ASTM A276 · ISO 15510 · ASTM A967 passivation
Chamber Bodies
Cover Plates
Gas Distribution Plates
Flange Adapters
Aluminium 6061-T651
T651 stress-relieved plate — the only correct Al stock for precision semiconductor equipment bases and mounting plates. T6 temper provides yield strength; T651 stress relief eliminates residual stresses that cause post-machining distortion in large thin plates. Hard-anodized Type III for surface protection.
Tensile Strength
310 MPa
Flatness (plate)
±0.003 mm after stress relief + grind
Surface Treatment
Hard Anodize Type III · Anodize Type II
Key Feature
T651 = no post-machine distortion on large plates
Mounting Plates
Equipment Bases
Structural Frames
PEEK & Carbon-Loaded PEEK
PEEK for electrical insulation and chemical resistance in semiconductor contact parts. C-PEEK (carbon-loaded) for ESD-safe versions — same chemical properties as PEEK but with controlled surface resistivity for static dissipation. Both vacuum-compatible with low outgassing.
Tensile Strength
100 MPa (PEEK) / 85 MPa (C-PEEK)
Surface Resistivity
PEEK: >10¹⁵ Ω/sq · C-PEEK: 10⁶–10⁹ Ω/sq
Max Service Temp
250°C continuous
Chemical Resistance
Excellent — most process chemicals
Insulating Standoffs
ESD Fixtures (C-PEEK)
Wafer Contact Tips
Production Workflow
From Drawing to Leak-Tested, Clean-Room Packed Part
01
Drawing Review — Vacuum Compatibility & Material Selection
Chamber geometry reviewed for blind holes (trapped gas), rough surface areas (outgassing), and flange standards. Material selected — SS316L for vacuum-wetted surfaces, Al for structural, PEEK/ceramic for insulation. Feedback within 24h.
02
Precision CNC Machining
Chamber bores, port positions, and sealing face features machined on horizontal machining center. All flange bores positioned in single setup to maintain concentricity and perpendicularity. Sealing faces milled to ±0.005 mm flatness before grinding/lapping.
03
Sealing Face Grinding / Lapping
Critical vacuum sealing faces ground to ±0.003 mm flatness. Knife-edge Conflat faces precision turned and then ground for parallelism. O-ring face seal surfaces lapped as required. CMM flatness verification.
04
Surface Treatment — EP / Passivation / Anodize
SS316L parts electropolished to Ra ≤0.25 μm. Passivation per ASTM A967. Aluminium parts hard-anodized Type III. All treatments documented. Internal surfaces re-measured for Ra after EP to verify spec.
05
Helium Leak Test & CMM Inspection
Helium mass-spectrometer leak test on each individual part. Leak rate recorded against part serial number. CMM dimensional verification of all port positions and sealing face features. Both results in delivery documentation.
06
Clean-Room Cleaning & Packaging
Ultrasonic clean in DI water, IPA rinse, nitrogen blow-dry in ISO Class 5 clean-room. Double-bagged in ESD-safe film under nitrogen purge. Leak test cert, material cert, and inspection report enclosed. Shipped in rigid protective packaging.
Quality System
Every Vacuum Part Tested, Documented & Certified
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He Leak Test Certificate on Every Vacuum Part
No vacuum part shipped without a documented helium mass-spectrometer leak test. Cert includes test date, part serial number, test result (mbar·l/s), and equipment calibration status. Included in base price — not a premium add-on.
✦
EP Surface Ra Measured & Reported
Electropolished internal surfaces measured by contact profilometer after EP. Ra value recorded against part number. Not assumed from EP process parameters — actually measured. Profilometry report included with delivery documentation.
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ISO Class 5 Clean-Room Pack — All Semiconductor Parts
All semiconductor equipment parts cleaned in ISO Class 5 environment and double-bagged under nitrogen purge. Particle count certification available for process gas and UHV-wetted parts on request.
⚙
Ceramic-to-Metal Assembly Isolation Verified
Every ceramic-to-metal assembly has insulation resistance measured after assembly — not just the individual components. Parts with <10¹² Ω·cm resistance after assembly are identified, investigated, and corrected before shipment.
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ISO 9001:2015
Quality management system for all orders
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He Leak Cert
Mass-spectrometer test on every vacuum part
✦
ASTM A967
SS passivation standard certification
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ISO Class 5
Clean-room cleaning and packaging
⚡
IEC 61340-5-1
ESD surface resistivity certification
📐
CMM Report
Dimensional verification on all precision parts
Our Advantage
Why Semiconductor Equipment Teams Rely on Our Parts
He
Leak Test Standard — Not Optional
Helium mass-spectrometer leak test included on every vacuum part as standard. Not an upgrade. Not available on request. Every chamber body, cover plate, and gas plate tested and certified before it leaves our facility.
EP
Electropolished & Process Gas Ready
SS316L components electropolished to Ra ≤0.25 μm, passivated, and He leak tested — ready for direct installation into CVD, etch, and ALD chambers. No additional chemical treatment required at the equipment integrator.
ESD
ESD & Ceramic Specialists
C-PEEK ESD fixtures with measured and certified resistivity. Ceramic-to-metal assemblies with verified isolation resistance. The materials knowledge and measurement capability to deliver these composite parts correctly — not just attempt them.
CR
ISO Class 5 Clean-Room — In-House
In-house ISO Class 5 cleaning room — not outsourced cleaning. Full control over the cleaning protocol, nitrogen purge packaging, and particle count verification. Your parts do not leave our quality system between machining and delivery.
Get a Quote
Send Your Drawing.
Get a Quote.
Every enquiry includes a DFM review — tolerance feasibility, material confirmation, and process approach confirmed before production starts. MOQ 1 piece.
24hr
Quote Response
MOQ 1
Prototypes OK
ISO
9001:2015
📐
DFM Review on Every Enquiry
Tolerance feasibility, fixturing strategy, and material confirmation. Specific, actionable feedback — not generic pushback.
🎯
First Article Inspection — Standard
FAI report on every new run. Material certs and surface treatment certs included with every shipment.
🔄
Same Process: Prototype to Production
Process plan from your prototype applies to production batches. No re-qualification when you scale.
⚙
3 / 4 / 5-Axis CNC + Turning
Complex structural parts, shafts, housings, and transmission components. Metals and engineering plastics.
ISO 9001:2015
3/4/5-Axis Milling
CNC Turning
CMM Inspection
Global Delivery