Precision Fluid
& Manifold
Components
20 product lines — hydraulic and pneumatic manifolds, vacuum chambers, cooling plates, precision valve bodies, nozzle blocks, pump housings, micro-channel plates, and high-integrity sealing connectors. Where internal geometry, surface finish, and leak tightness define the part.
20 High-Precision Fluid & Manifold
Product Lines
Click any category to expand · All parts machined to drawing · MOQ 1 piece · Leak test included
Hydraulic, pneumatic, vacuum, and fluid-distribution manifold blocks machined from solid billet — replacing tube and fitting assemblies with a single leak-free monolithic block. Internal cross-drillings, port face sealing surfaces, and cartridge valve cavities all machined in a single part. O-ring face seal (ORFS), SAE, BSP, NPT, and metric port standards available on request.
Cooling channel plates and liquid cold plates for electronics thermal management, laser systems, power modules, and EV battery cooling. Internal coolant channels machined or deep-drilled, then sealed by brazing, friction-stir welding, or bolted cover plate. Flatness of mounting face ±0.005 mm to ensure intimate thermal contact with heat-generating component. Leak tested at 1.5× working pressure before delivery.
Precision valve bodies, spool bores, valve seats, and proportional valve components where bore roundness, cylindricity, and surface finish directly determine valve leakage and spool hysteresis. Spool bores held to H6 tolerance with roundness ≤0.003 mm. Seat taper angles and seat contact face widths machined to drawing. All valve parts degreased, deburred, and inspected for contamination before delivery.
Nozzle blocks, precision flow-control orifices, nozzle seat bodies, and pump housing components where orifice diameter, seat geometry, and internal passage surface finish determine flow characteristics. Orifice diameters from 0.1 mm upward. Nozzle seat taper angle held to ±0.02°. Pump housing bores for gear, vane, and piston pumps machined to H6/H7 with flatness on port faces.
Micro-channel plates, semiconductor process gas distribution plates, ultra-high vacuum chamber parts, cavity cover plates, sealing face components, and multi-port high-integrity connectors for semiconductor fabrication, clean-room instrumentation, and UHV research systems. Electropolished internal surfaces, helium leak tested, and packaged in clean-room conditions. All wetted surfaces compatible with corrosive process gases (HCl, F₂, Cl₂, NF₃) available in electropolished 316L or PFA-lined aluminium.
What Makes Manifold &
Cavity Machining Different
Tolerances & Sealing Specifications — All Product Lines
Surface Finishes & Treatments for Fluid Compatibility
Internal and external surface treatments matched to fluid medium, operating pressure, and chemical compatibility.