Particle-Free Process
Chamber Internal Components
Ultra-clean CNC machined vacuum chamber internal components — shields, baffles, diffusers, and mounting structures. Burr-free deburring verified at 10× magnification, Ra 0.8 µm or better, zero loose particles after ultrasonic cleaning and UV inspection. Al 6061 hard-anodized or SUS316L electropolished for plasma process, CVD, etch, and deposition chamber interiors.
verified under 10× mag
process environment grade
ISO Class 5 standard
prototype orders
Chamber Internal Component Challenges
Internal components are in direct contact with the process environment — any loose particle, burr, or surface contamination can directly contaminate wafers or affect process chemistry.
Chamber Internal Components We've Made
Real CNC machined semiconductor components — cleaned, inspected, cleanroom-packaged.
Al 6061 · Shield
Al 6061 · Bracket
SUS316L · Diffuser
Al 6061 · Liner
SUS316L · Ring
Al 7075 · Mount
SUS316L · BatchWhat We Can Deliver
Typical specifications — confirm exact requirements at enquiry.
| Deburring standard | Burr-free, 10× mag verified |
| Internal Ra | 0.8 µm std (0.4 µm avail) |
| Particle cleanliness | UV inspect, zero loose |
| Thin wall min | 1.0 mm Al / 1.2 mm SUS |
| CMM inspection | All critical dimensions |
| Packaging | ISO Class 5, N₂ purge |
| Materials | Al 6061/7075, SUS316L, PEEK |
| Deburring | Tool + CO₂ snow + US |
| Cleaning | IPA US + N₂ dry + UV |
| Lead time (proto) | 7–10 days |
| Lead time (batch) | 12–18 days |
| Thin-wall DFM | Included in quote |
From Drawing to Cleanroom-Ready Part
Upload your drawing — DFM review, machining, cleaning, inspection, cleanroom packaging.
Trusted by Semiconductor Equipment Engineers
Chamber Internal Components — FAQ
Engineering and procurement questions answered by our semiconductor components team.
Send Your Drawing.
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Every enquiry includes a DFM review — tolerance feasibility, material confirmation, and process approach confirmed before production starts. MOQ 1 piece.