Product Category
Orifice ±0.005 · Ra 0.4 · He-Leak 1e-8 · Multi-Zone · MOQ 1
GDP / 001 — 010
Ultra-Clean CNC
Gas Distribution Plates
Ultra-clean CNC machined semiconductor gas distribution plates — internal flow channel Ra 0.4 µm, orifice diameter ±0.005 mm, orifice position ±0.01 mm, sealing face flatness ≤ 0.008 mm, helium leak rate < 1×10⁻⁸ mbar·l/s. For CVD, ALD, etch, and MOCVD process chamber gas delivery — including multi-zone configurations with center+edge orifice density control.
±0.005mm
Orifice Diam.
Ra 0.4µm
Internal Ch.
1e-8
He-Leak
PART DWG · GDP-001 SHOWER HEAD · SUS316L EP · Ra 0.4 · He-LEAK 1e-8
ISO 9001 · ELECTROPOLISH · CMM
Orifice ±0.005
Multi-Zone Density
CVD · ALD · Etch · MOCVD · PECVD · Epitaxy
Applications
SUS316L EP · Al 6061 · Ti Gr5
Materials
48hr Quote · 8-Day Proto · MOQ 1
Service
<1×10⁻⁸
Leak Rate
mbar·l/s He test
mbar·l/s He test
±0.005mm
Orifice Diameter
precision drilled
precision drilled
Ra 0.4µm
Internal Channel
electropolished
electropolished
8 Days
Fastest Delivery
prototype orders
prototype orders
Machining Challenges
Gas Distribution Plate Challenges
Gas distribution plates for semiconductor process chambers require the most demanding combination of cleanliness, flow uniformity, and leak integrity in any CNC product.
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Orifice Uniformity for Process Uniformity
Non-uniform orifice diameters cause uneven gas flux across the wafer — directly causing film thickness or etch rate non-uniformity. HXC holds orifice diameter to ±0.005 mm across all holes, verified by CMM or optical microscope.
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Ultra-Clean Internal Channels
Process gases must not be contaminated by machining residues. All internal channels are electropolished to Ra 0.4 µm, ultrasonically IPA-cleaned, and helium leak tested. Any trapped residue outgasses into the process environment.
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Leak-Tight Sealing Interfaces
Process chamber gas distribution plates operate at pressures from vacuum to several bar. Every sealing interface must be leak-tested to <1×10⁻⁸ mbar·l/s before installation in the chamber.
Our Work
Request Similar Part →
Gas Distribution Plates We've Made
Real CNC machined semiconductor components — cleaned, inspected, and cleanroom-packaged.
SUS316L · CVDCVD Shower Head Plate
Orifice ±0.005mm · Elec. · 5 pcs
Al 6061 · ALDALD Gas Distribution Plate
CF ports · Anodized · 6 pcs
SUS316L · EtchEtch Chamber Gas Plate
Dense array · 4 pcs
SUS316L · MOCVDMOCVD Gas Shower Head
Precision orifice · 3 pcs
Al 6061 · PECVDPECVD Distribution Plate
Multi-zone · 6 pcs
SUS316L · CustomCustom Process Gas Plate
R&D · 3 pcs
SUS316L · EpitaxyEpitaxy Gas Distribution Plate
UHV · 2 pcs
Al 6061 · BatchGas Distribution Plates — Batch
10 pcs · He-leak cert
Capabilities & Tolerances
What We Can Deliver
Typical specifications — confirm exact requirements at enquiry.
| Leak rate | <1×10⁻⁸ mbar·l/s (He) |
| Internal Ra | 0.4 µm (electropolished) |
| Orifice diameter tol. | ±0.005 mm |
| Sealing face flatness | ≤ 0.008 mm |
| Port standards | VCR, CF, KF, custom |
| Particle cleanliness | ISO Class 5 compatible |
| Materials | SUS316L, Al 6061, Ti Grade 5 |
| Electropolish | Standard — all gas-wetted |
| Helium test | 100% every plate + cert |
| Cleaning | IPA ultrasonic + N₂ + bag |
| Lead time (proto) | 8–12 days |
| Lead time (batch) | 14–20 days |
How It Works
From Drawing to Cleanroom-Ready Part
Upload your drawing — DFM review, machining, cleaning, inspection, and cleanroom packaging within agreed lead time.
01
Upload Drawing
STEP, DXF, PDF. Include orifice layout, gas, and cleanliness class.
02
DFM & Quote
Free DFM — orifice manufacturability, multi-zone strategy. Quote in 48 h.
03
Machine, Clean & Test
CNC + electropolish, ultrasonic clean, CMM, He-leak test.
04
Ship Worldwide
Full dimensional report + cleaning + He-leak cert enclosed.
Reviews
Trusted by Semiconductor Equipment Engineers
★★★★★
"Surface cleanliness and packaging met our cleanroom incoming inspection requirements immediately. Dimensional report matched our CMM check perfectly."
LW
Li Wei
Process Equipment Engineer · Taiwan
★★★★★
"HXC understood the vacuum sealing requirements for our chamber components without lengthy explanation. Lead time was exactly as quoted."
SL
Sophie L.
Equipment Design Engineer · South Korea
★★★★★
"We've sourced wafer handling and chamber parts from HXC for two years. Cleanliness, dimensional accuracy, and batch consistency are excellent."
JT
James T.
Senior Procurement · USA
FAQ
Gas Distribution Plates — FAQ
Engineering and procurement questions answered by our semiconductor components team.
Uniform distribution requires: (1) Orifice diameter ±0.005 mm across all holes — diameter variation changes individual hole flow resistance; (2) Orifice position accuracy ±0.01 mm — ensures uniform spatial flux; (3) Identical internal channel pressure drop — distribution manifold designed for equal resistance. All three verified by CMM.
Post-machining cleaning: (1) Degreasing; (2) Electropolishing all gas-wetted surfaces (Ra 0.4 µm); (3) IPA ultrasonic; (4) DI rinse; (5) N₂ blow-dry; (6) UV lamp inspection; (7) ISO Class 5 cleanroom packaging. Particle count certificate available for semiconductor-grade plates.
Yes — multi-zone plates with different orifice densities in centre and edge zones (radial gas profile control) are routinely machined. Zone boundaries, orifice counts, and diameters per zone are all specified on the customer drawing and CMM-verified.
VCR face seal (Swagelok), CF ConFlat (knife-edge UHV), KF (ISO 2861), and custom face seal flanges. All interface dimensions machined to manufacturer's spec and verified by CMM. Mixed interface types on the same plate are routine.
Every plate is tested by helium mass spectrometry: pressurised with helium, all external surfaces and ports scanned. Leak rate: <1×10⁻⁸ mbar·l/s standard (<1×10⁻¹⁰ UHV). Certificate includes measured rate, instrument calibration date, test date, operator signature.
Yes — gas distribution plates with integrated heater cartridge bores or resistive heater grooves are machined in the same operation as gas channels. Heater bore position tolerance: ±0.1 mm from gas channel wall (minimum clearance reviewed in DFM). Thermocouple insertion bores available.
Standard mechanical drilling: Ø0.2 mm minimum. Below Ø0.2 mm we use precision micro-drilling or EDM hole drilling. Aspect ratio limit (depth ÷ diameter): 10:1 for drilling, up to 50:1 for EDM. Orifice tolerance is maintained at ±0.005 mm regardless of method.
Prototype: 8–12 days. Batch: 14–20 days. UHV plates with <1×10⁻¹⁰ leak test: add 2–3 days. Multi-zone with high orifice count (>200 holes): add 2–4 days.
Get a Quote
Send Your Drawing.
Get a Quote.
Every enquiry includes a DFM review — tolerance feasibility, material confirmation, and process approach confirmed before production starts. MOQ 1 piece.
24hr
Quote Response
MOQ 1
Prototypes OK
ISO
9001:2015
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DFM Review on Every Enquiry
Tolerance feasibility, fixturing strategy, and material confirmation. Specific, actionable feedback — not generic pushback.
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First Article Inspection — Standard
FAI report on every new run. Material certs and surface treatment certs included with every shipment.
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Same Process: Prototype to Production
Process plan from your prototype applies to production batches. No re-qualification when you scale.
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3 / 4 / 5-Axis CNC + Turning
Complex structural parts, shafts, housings, and transmission components. Metals and engineering plastics.
ISO 9001:2015
3/4/5-Axis Milling
CNC Turning
CMM Inspection
Global Delivery