PEEK CNC
Machined
Parts

PEEK semiconductor process equipment insulating components, electrical assembly insulating parts, and precision insulating brackets for CVD, ALD, etch, ion implant, and inspection equipment. PEEK advantages over alternative insulating plastics (PTFE, POM, G10) for semiconductor applications: (1) Temperature — PEEK maintains structural integrity and dimensional stability at 200–250°C, suitable for hot-wall CVD reactor components where POM would melt and PTFE would cold-flow; (2) Halogen resistance — PEEK resists Cl₂, HCl, F₂, HF, and other process gases that attack POM and nylon; (3) Dimensional stability — moisture absorption <0.5% (vs nylon 2.5–8%) allows H7 bore tolerance to be maintained in the variable-humidity semiconductor fab environment; (4) UHV compatibility — PEEK outgassing rate after baking at 150°C is acceptable for HV applications (10⁻⁸–10⁻⁹ Pa·m³/s); (5) Non-magnetic — no interference with ion implant magnetic fields or electron beam equipment. Semiconductor insulating parts: bore H7, profile ±0.05mm, Ra ≤0.4μm. Electrical insulating blocks and spacers: CTI ≥175V, UL 94 V-0, profile ±0.05mm. Precision insulating brackets: bore H7, face flatness ±0.02mm, CMM GD&T verification.

PEEK and implant-grade PEEK medical device structural parts (ISO 10993 biocompatible, sterilisation-compatible, MRI-compatible, radiolucent) and high-performance structural components for demanding mechanical applications requiring plastic properties with near-metal strength. Medical device parts: Ra ≤0.4μm; bore H7; sterilisation method confirmed (autoclave 134°C, gamma irradiation up to 25 kGy, EtO, or H₂O₂ plasma — all compatible with standard PEEK). ISO 10993 manufacturing documentation package included. Implant-grade PEEK (Invibio PEEK-OPTIMA or equivalent) with lot-traceable certificate for implant-adjacent applications. High-performance structural parts: PEEK-CF30 (30% carbon fibre) tensile strength ~200 MPa, modulus ~13 GPa — highest specific stiffness of common plastic composites; non-magnetic; dimension stable; profile ±0.05mm; bore H7.

PEEK high-temperature plain bearing bushings (bore H7, Ra ≤0.4μm bore, 250°C continuous service — used in vacuum ovens, hot test fixtures, semiconductor annealing equipment, and chemical reactor accessories where no metal bushing can be used due to conductivity or contamination requirements), PEEK high-temperature seal bodies (bore H7, chemical resistant, -40°C to +250°C — for seal assemblies in high-temperature chemical processing where PTFE would cold-flow and PA66 would soften), and PEEK-GF30 / PEEK-CF30 wear-resistant guide liners and strips (profile ±0.05mm, 250°C service, significantly better wear resistance than unfilled PEEK). PEEK-CF30 for maximum wear resistance in continuous sliding contact — carbon fibre provides self-lubricating effect at elevated temperature. PEEK bushing bore H7 maintained in service: moisture absorption <0.5% and thermal expansion coefficient 47×10⁻⁶/°C (lower than POM 100×10⁻⁶/°C) — bore dimensional change from ambient to 200°C is predictable and can be compensated in bore specification at DFM.