Electro-
plating
Services

Electrolytic zinc plating for carbon steel CNC parts — the most cost-effective corrosion protection method for steel components. Zinc provides sacrificial galvanic protection: zinc corrodes preferentially, protecting the steel substrate. Layer 5–25μm. Post-plating chromate conversion coating significantly extends corrosion protection: clear Cr³⁺ chromate (RoHS, ~100–200 hours salt spray); yellow chromate (~500 hours). Zinc-nickel alloy plating (10–15% Ni) available for applications requiring >1000 hours salt spray without increased layer thickness. Specifications: ASTM B633, ISO 2081.

Electroless nickel (EN) — autocatalytic chemical deposition producing a highly uniform layer (±1–2μm) on all surfaces including internal bores, cross-holes, and recesses. EN phosphorus content 8–12% (medium-P); heat-treatable to HV 500–700. Ideal for precision hydraulic components and semiconductor equipment. Electrolytic nickel — faster and cheaper for simple geometries; non-uniform on complex shapes. Both provide excellent corrosion resistance and a hard, wear-resistant silver-grey surface. EN compliant with RoHS; no cadmium or hexavalent chromium.

Thick hard chrome (functional chrome) for wear-resistant surfaces. Layer 5–250μm; hardness HV 800–1000; coefficient of friction ~0.16 (low). Standard for hydraulic rod and cylinder bore surfaces, industrial press tooling, and high-wear sliding components. Trivalent chromium (Cr³⁺) hard chrome available for RoHS-regulated applications — equivalent hardness and wear performance to traditional Cr⁶⁺ hard chrome with RoHS compliance. Post-plate grinding to tight tolerances (±0.005–0.010mm) available for hydraulic rod applications. Specification: AMS 2406, AMS 2460 (hard chrome).

Copper electroplating for EMC/RF shielding on plastic or composite enclosures; as a base undercoat (strike layer) to improve adhesion of subsequent nickel or chrome plating; thermal management applications where copper's high thermal conductivity is needed on a steel substrate; and PCB-style copper interconnects on machined ceramic substrates. Layer 10–50μm standard; up to 200μm for heavy thermal management applications. Copper is highly ductile — allows subsequent plating layers to be applied without cracking at substrate steps.

Silver electroplating for electrical contacts, RF and microwave connectors, bus bars, and high-frequency components where silver's highest electrical conductivity of any metal (63 MS/m) and low contact resistance are required. Layer 2–25μm. Silver over copper substrate for bus bars and power contacts; silver over nickel over steel for switchgear contacts; silver on aluminium (with zincate pre-treatment) for RF waveguide components. Anti-tarnish lacquer topcoat available to maintain low contact resistance in ambient atmosphere. Specification: ASTM B700.

Hard gold (Co or Ni alloyed, HV 130–180) for PCB edge connectors and high-cycle sliding contacts; soft gold (99.99% Au, HV 60–80) for wire bonding pads and Class III medical contact surfaces. Layer 0.05–5μm over nickel undercoat (nickel acts as diffusion barrier preventing gold from diffusing into copper substrate). IPC-4552 minimum gold thickness for PCB edge connectors: 1.27μm (50μin) for >100 insertion cycles. We calculate minimum gold thickness meeting functional requirement at DFM — gold is the most expensive plating metal and over-specification adds significant cost with no functional benefit.

Bright or matte tin plating for solderability, corrosion resistance, and food-contact applications. Layer 3–25μm. Tin is RoHS compliant (pure tin replaces lead-tin solder alloys on PCB contact surfaces). Matte tin preferred over bright tin for applications where tin whisker growth is a reliability concern — bright tin additives increase whisker susceptibility. IEC 60068-2 whisker testing available for aerospace and medical device applications. Food-contact tin plating: FDA compliant for food packaging and processing equipment. Post-plate baking (150°C, 1 hour) for hydrogen embrittlement relief on high-strength steel substrate.