Product Category
<1×10⁻⁹ · EP Ra 0.4µm · ±0.005mm Orifice · ISO 5
SGP / 001 — 008
Ultra-Clean CNC
Semiconductor Gas Distribution Plates
Ultra-clean CNC machined semiconductor gas distribution plates — electropolished internal channels Ra 0.4 µm, VCR/CF port interfaces, helium leak test <1×10⁻⁹ mbar·l/s, ISO Class 5 cleanroom packaging. For CVD, ALD, and etch process chambers.
<10⁻⁹
He Leak
±0.005mm
Orifice Ø
ISO Cl.5
Cleanroom
PART DWG · SGP-000 SHOWER HEAD · SUS316L EP · SEMI F57
ISO 9001 · ISO Cl.5
Hexagonal Orifice Pattern
Ø 0.5 ±0.005
CVD · ALD · Etch · MOCVD · Epitaxy · R&D
Use Cases
SUS316L EP · Al 6061 HA · Ti · Hastelloy
Materials
48hr Quote · 8-Day Proto
Service
<1×10⁻⁹
Leak Rate
mbar·l/s helium test
mbar·l/s helium test
Ra 0.4µm
Internal Surface
electropolished SUS316L
electropolished SUS316L
ISO Cl.5
Cleanroom Pack
semiconductor grade
semiconductor grade
8 Days
Fastest Delivery
prototype orders
prototype orders
Machining Challenges
Semiconductor Gas Distribution Plate Challenges
Gas distribution plates for semiconductor process chambers require a combination of standards unmatched in any other CNC product: ultra-clean surfaces, sub-ppm particle generation, and helium-leak-tight interfaces.
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Ultra-Clean Internal Surfaces
Process gas must not be contaminated by machining residues or surface oxides. HXC electropolishes all gas-wetted surfaces to Ra 0.4 µm, removing the chromium-depleted layer and producing a passivated, low-outgassing surface compatible with reactive process gases.
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Uniform Gas Distribution
Shower head plates and distribution manifolds must deliver equal gas flux through every orifice. HXC holds orifice diameter to ±0.005 mm across all holes — any variation creates non-uniform film deposition or etch rates across the wafer.
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Helium Leak Integrity
Semiconductor process chambers operate at mTorr pressures. Every gas-path connection must be helium-leak tight to <1×10⁻⁹ mbar·l/s. HXC tests every plate by helium mass spectrometry leak detection before cleanroom packing.
Our Work
Request Similar Part →
Semiconductor Gas Distribution Plates We've Made
Real CNC machined projects — inspected and delivered.
Capabilities & Tolerances
What We Can Deliver
Typical specifications for this product type. Confirm exact requirements at enquiry.
| Leak rate | <1×10⁻⁹ mbar·l/s (He) |
| Internal Ra | 0.4 µm (electropolished) |
| Orifice diameter tol. | ±0.005 mm |
| Port standards | VCR, CF, KF, custom face seal |
| Cleaning | IPA ultrasonic + N₂ dry + cleanroom pack |
| Particle generation | ISO Class 5 equivalent |
| Materials | SUS316L (std), Al 6061, Ti Grade 5 |
| Electropolish | Standard on all gas-wetted surfaces |
| Helium leak test | 100% every plate, certificate |
| Packaging | ISO Class 5 bag, double-sealed |
| Lead time (proto) | 8–12 days |
| Lead time (batch) | 14–20 days |
How It Works
From Drawing to Finished Part
Upload your drawing — DFM review, machining, pressure/leak test if required, and shipping within agreed lead time.
01
Upload Drawing
STEP, DXF, PDF. Include channel specs, thread standards, and sealing requirements.
02
DFM & Quote
Free DFM review — channel access, deburring feasibility, sealing surface strategy. Quote in 48 h.
03
Machine & Test
CNC machining, deburring, cleaning, CMM inspection, pressure/leak test as specified.
04
Ship Worldwide
Inspection report + test records enclosed. DHL / FedEx / sea freight.
Reviews
Trusted by Engineers Worldwide
★★★★★
"Deep cross-drilled channels were deburred perfectly — zero burrs found at our incoming inspection. Leak test passed first time. Delivery exactly on schedule."
MK
Martin K.
Hydraulic Systems Engineer · Germany
★★★★★
"We source precision valve bodies and manifold blocks from HXC. Bore coaxiality is consistently within 0.005 mm, sealing surface Ra verified on every batch."
SL
Sophie L.
Procurement Manager · France
★★★★★
"HXC understood the cleanliness requirements for our semiconductor gas distribution plates immediately. Documentation package was complete and traceable."
JT
James T.
Process Engineer · Taiwan
FAQ
Frequently Asked Questions About Semiconductor Gas Distribution Plate Machining
Engineering and procurement questions answered by our team.
HXC produces semiconductor gas distribution plates to SEMI F57 equivalent cleanliness: (1) electropolished internal surfaces Ra 0.4 µm; (2) ultrasonic IPA cleaning; (3) N₂ purge and dry; (4) ISO Class 5 cleanroom packaging; (5) particle count certificate available. All operations from cleaning through packaging performed in a cleanroom environment.
All orifices are drilled in a single setup using a calibrated precision drill with on-machine diameter verification between sets of holes. Orifice diameter tolerance: ±0.005 mm. Orifice position tolerance: ±0.01 mm. For shower heads with >1,000 orifices, statistical sampling of 10% of holes is reported in the inspection certificate.
SUS316L (electropolished): compatible with most process gases including O₂, N₂, Ar, He, H₂, NF₃, and dilute HCl. Al 6061 (hard anodized): for fluorine-based chemistries (HF, NF₃, F₂) where alumina (Al₂O₃) anodize layer provides chemical resistance. Ti Grade 5: for oxidising and chlorine-based chemistries. We recommend confirming material compatibility with your specific process chemistry before ordering.
HXC machines all standard ultra-high-purity gas line interfaces: VCR (Swagelok face seal), CF ConFlat knife-edge, KF (ISO 2861), and custom face seal flanges. All interface dimensions are machined to manufacturer's specification and verified by CMM.
Every plate is tested by helium mass spectrometry leak detection: the part is pressurised with helium and a leak detector probe scans all external surfaces and ports. Measured leak rate: <1×10⁻⁹ mbar·l/s standard. Test certificate includes: instrument calibration date, test date, measured leak rate, and operator signature. This certificate is provided with every plate.
Yes — gas distribution plates with integrated heating cartridge bores or resistive heater grooves can be machined in the same setup as the gas distribution channels. Heater bore position tolerance: ±0.1 mm from gas channel wall (minimum clearance). We can also machine temperature sensor (thermocouple) insertion bores.
Prototype: 8–12 days (includes electropolish + helium leak test + cleanroom packaging). Batch (3–10 pcs): 14–20 days. Production (10+ pcs): 18–26 days. Rush proto: 5–7 days available — contact us.
Standard documentation package: (1) CMM dimensional report; (2) Helium leak test certificate; (3) Electropolish process certificate; (4) Material mill certificate (SUS316L lot, heat number); (5) Cleanroom packaging record. All documents are traceable to the specific production batch.
Get a Quote
Send Your Drawing.
Get a Quote.
Every enquiry includes a DFM review — tolerance feasibility, material confirmation, and process approach confirmed before production starts. MOQ 1 piece.
24hr
Quote Response
MOQ 1
Prototypes OK
ISO
9001:2015
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DFM Review on Every Enquiry
Tolerance feasibility, fixturing strategy, and material confirmation. Specific, actionable feedback — not generic pushback.
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First Article Inspection — Standard
FAI report on every new run. Material certs and surface treatment certs included with every shipment.
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Same Process: Prototype to Production
Process plan from your prototype applies to production batches. No re-qualification when you scale.
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3 / 4 / 5-Axis CNC + Turning
Complex structural parts, shafts, housings, and transmission components. Metals and engineering plastics.
ISO 9001:2015
3/4/5-Axis Milling
CNC Turning
CMM Inspection
Global Delivery