Product Category
THM — 001 to 014
Thermal Management
& Heat Sink Parts
14 product lines covering the complete thermal management spectrum — fin heat sinks, cold plates, thermal spreaders, power module heat blocks, LED coolers, computer CPU coolers, SSD heat sinks, cold-forged heat sinks, copper heat sinks, and aluminium heat sinks. Every gram of heat removed reliably.
Copper Conductivity
401 W/m·K
Best thermal conductivity — copper heat sinks and cold plates
Al6063 Conductivity
209 W/m·K
Best fin anodize quality — standard for LED and extruded heat sinks
Min Fin Thickness
0.5 mm
Skived fin — 10× higher fin density than milled heat sinks
Base Flatness
±0.05 mm
Heat source contact base — critical for junction-to-ambient resistance
Cold Plate Test
15 bar
Hydraulic pressure test on all liquid-cooled cold plates
14
Product Lines
401 W/m·K
Cu Conductivity
0.5 mm
Min Fin Thickness
±0.05 mm
Base Flatness
24 hr
Quote Turnaround
Heat Sinks ✦
Heat Sink Bases ✦
Cold Plates ✦
Thermal Spreader Plates ✦
Power Module Heat Blocks ✦
LED Heat Sinks ✦
Extruded Heat Sinks ✦
Die-Cast Heat Sinks ✦
Copper Heat Sinks ✦
Aluminium Heat Sinks ✦
Computer CPU Coolers ✦
SSD Heat Sinks ✦
CPU Heat Sinks ✦
Cold-Forged Heat Sinks ✦
Heat Sinks ✦
Heat Sink Bases ✦
Cold Plates ✦
Thermal Spreader Plates ✦
Power Module Heat Blocks ✦
LED Heat Sinks ✦
Extruded Heat Sinks ✦
Die-Cast Heat Sinks ✦
Copper Heat Sinks ✦
Aluminium Heat Sinks ✦
Computer CPU Coolers ✦
SSD Heat Sinks ✦
CPU Heat Sinks ✦
Cold-Forged Heat Sinks ✦
Full Product Range
14 Thermal Management
Heat Sink Product Lines
Select a category tab · All parts custom to drawing · MOQ 1 piece · Thermal performance verified
Product Categories
Fin Heat Sinks & Thermal Bases
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CNC machined fin heat sinks, heat sink base bodies, and thermal spreader plates — the fundamental thermal management components for electronics cooling, power devices, and industrial systems. Fin geometry (height, pitch, thickness, taper) machined to custom specification. Base contact face flatness ±0.05 mm for reliable thermal contact resistance. Black anodize for maximum emissivity ε ≈ 0.86 on passive cooling applications.
THM-001
FIN HEAT SINKS / 001 — FEATURED
CNC Machined Fin Heat Sinks
Custom pin-fin and straight-fin heat sinks CNC milled from Al6061 or Al6063 billet. Fin geometry (height up to 80 mm, pitch down to 2 mm, thickness 1 mm) designed to target thermal resistance Rth. Base contact face flatness ±0.05 mm for low contact resistance. Fin slot milled by end mill — fin thickness limited by tool diameter (1 mm min). For higher fin density, skived fin process available (0.5 mm fin, 0.5 mm gap). Black anodize Type II standard for passive cooling — surface emissivity ε ≈ 0.86 increases radiated heat flux by 5–8× vs bare aluminium. Custom mounting hole pattern and through-hole for fasteners.
Al6061 · Al6063 · Al6061-T6 · Cu C110
Get Quote
THM-002
FIN HEAT SINKS / 002
Heat Sink Bases
Solid heat sink base bodies without fins — designed as thermal interface between heat source and external fin array or cooling system. Base flatness ±0.02 mm on heat-source contact face. Mounting boss and screw patterns for spring-clip or bolt-down attachment. Used where fin array is a separate bonded or brazed component.
Al6061 · Cu · Al-SiCGet Quote
THM-003
FIN HEAT SINKS / 003
Thermal Spreader Plates
Heat spreader plates for spreading concentrated heat from a small source area across a larger fin or cooling surface. High thermal conductivity material — Cu C110 (401 W/m·K) or Al-SiC composite. Flatness ±0.02 mm on both faces. Used between IGBT modules, laser diodes, and LED arrays and the main heat sink body.
Cu C110 · Al-SiC · Al6061Get Quote
Materials: Al6061 · Al6063 · Cu C110 · Al-SiC Composite
Request All 3 →
Cold Plates & Power Module Heat Blocks
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Liquid cold plates and power module heat blocks for high heat flux applications — EV inverters, traction drives, laser diode arrays, high-power RF amplifiers, and industrial power converters. Internal coolant channel geometry machined or deep-drilled; cover plate brazed, friction-stir welded, or bolted. Heat source contact face flatness ±0.005–0.02 mm. Pressure tested at 1.5× working pressure before delivery.
THM-004
COLD PLATES / 004 — FEATURED
Liquid Cold Plates
High-performance liquid cold plates machined from Al6061 or Al6063 with internal serpentine, parallel, or turbulent-insert coolant channels. Cover plate joined by vacuum brazing, friction-stir welding (FSW), or bolted O-ring seal. Heat source contact face ground to flatness ±0.005 mm for IGBT module or laser diode bar contact. Channel layout designed from thermal simulation data or CFD output. Working pressure to 10 bar standard; 20 bar available. Hydraulic pressure test at 15 bar (1.5× WP) with test certificate. Coolant connections: BSP, NPT, push-fit, or barb fittings machined integral or threaded. Copper cold plates for maximum thermal performance where weight is not a constraint.
Al6061 · Al6063 · Cu C110 · SS316
Get Quote
THM-005
COLD PLATES / 005
Power Module Heat Blocks
Solid or liquid-cooled heat blocks for IGBT, MOSFET, SiC, and GaN power modules. Module mounting face flatness ±0.005 mm — matching JEDEC TO-247, TO-264, and custom module package footprints. Mounting spring and fastener guide features machined integral. Thermal paste retention recess optional.
Al6061 · Cu · Al-SiC · SSGet Quote
THM-004B
COLD PLATES / 004B
Micro-Channel Cold Plates
High-performance micro-channel cold plates with channel widths 0.5–2 mm for concentrated heat flux applications — high-power laser diode arrays, GaN power amplifiers, and dense power converter modules. Channel geometry designed to minimise pressure drop at target flow rate. Vacuum brazed cover plate.
Al6061 · Cu C110Get Quote
Materials: Al6061 · Al6063 · Cu C110 · SS316 · Al-SiC
Request All 3 →
LED, Extruded & Die-Cast Heat Sinks
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LED heat sinks for high-power COB and SMD LED modules, extruded aluminium profile heat sinks CNC-machined from standard extrusion, and die-cast aluminium heat sinks machined to tolerance after casting. LED mounting face flatness ±0.05 mm for uniform LED thermal contact. Al6063 preferred for LED applications — highest thermal conductivity aluminium alloy with best anodize quality for appearance-critical luminaire applications.
THM-006
LED & SPECIALTY / 006 — FEATURED
LED Heat Sinks
Precision machined LED heat sinks for high-power COB LED modules (10 W–1000 W), multi-chip LED arrays, and custom LED PCB formats. LED mounting face flatness ±0.05 mm across the LED contact area — controlling junction temperature uniformity across multi-chip LED arrays. Fin array geometry designed to target thermal resistance Rth(hs-a) based on operating environment (natural convection, forced convection, or enclosure conduction). LED wire bond clearance notch and PCB locating edge machined integral. Al6063-T5 standard for highest thermal conductivity (209 W/m·K) and best anodize quality in visible luminaire applications. Black anodize inside channel fins for maximum radiated heat rejection; natural anodize on external reflector-adjacent surfaces for optical reflection. Star-shaped and circular LED heat sink formats available.
Al6063-T5 · Al6061 · Cu C110
Get Quote
THM-007
LED & SPECIALTY / 007
Extruded Aluminium Heat Sinks
Standard extruded aluminium profile (T-profile, zipper-fin, cross-fin) cut to length and CNC machined for mounting holes, slots, and end-face features. Cost-effective for medium volumes — extrusion has no tooling cost for standard profiles. Base face machined flat ±0.05 mm after extrusion. Custom extrusion profile tooling available for high volumes.
Al6063 · Al6061 ProfileGet Quote
THM-008
LED & SPECIALTY / 008
Die-Cast Heat Sinks (Post-Cast Machined)
Die-cast Al heat sinks with CNC post-cast machining of heat source contact faces, connector bosses, and mounting patterns. Die-casting enables complex 3D fin geometry impossible by extrusion or CNC milling. Post-cast base face machined flat ±0.05 mm to correct cast distortion. ADC12 (A380) alloy standard.
ADC12 · A380 · Al alloyGet Quote
Materials: Al6063-T5 · Al6061 · ADC12 Die-Cast · Cu C110
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Copper, Aluminium & Cold-Forged Heat Sinks
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Copper heat sinks for highest thermal conductivity (401 W/m·K — 2.4× aluminium), standard aluminium heat sinks for cost-effective general cooling, and cold-forged heat sinks for ultra-dense pin-fin geometry. Cold forging plastically deforms aluminium billet into near-net-shape pin-fin arrays — achieving pin diameters of 1.5 mm at 3 mm pitch, impossible by CNC milling, with no material waste and superior thermal performance.
THM-009
COPPER & COLD-FORGE / 009 — FEATURED
Copper Heat Sinks
Pure copper (C110/OFHC) heat sinks for highest thermal performance applications — high-power laser modules, medical imaging detectors, military radar electronics, and dense server processors where aluminium's thermal conductivity (167 W/m·K) is insufficient. Copper's 401 W/m·K conductivity reduces the temperature gradient from heat source to fin tip by 2.4× vs aluminium at identical geometry. Copper CNC milling requires lower cutting speed but achieves Ra ≤0.4 μm base face finish. Base contact face lapped to ±0.003 mm flatness and Ra ≤0.1 μm for direct chip or module contact without thermal interface material on premium applications. Nickel plating available for solderable surface or corrosion protection. Heavy — copper is 3.3× denser than aluminium; weight budget must be considered.
Cu C110 · OFHC Cu · Cu C101
Get Quote
THM-010
COPPER & COLD-FORGE / 010
Aluminium Heat Sinks
General-purpose aluminium heat sinks — the standard thermal solution for the majority of electronics cooling applications. Al6061 for structural rigidity; Al6063 for best thermal conductivity and anodize quality. Custom fin geometry, base flatness, and mounting pattern to drawing. Black anodize or natural anodize. Any size, any shape, MOQ 1 piece.
Al6061 · Al6063 · Al5052Get Quote
THM-011
COPPER & COLD-FORGE / 011
Cold-Forged Heat Sinks
Cold-forged pin-fin heat sinks with pin diameter 1.5–3 mm at 2–4 mm pitch — 5–10× higher fin density than CNC milled fins. Cold forging elongates aluminium grain structure along the pin axis, improving thermal conductivity along the pin by 10–15% vs milled. Pin surface Ra 0.4–0.8 μm. Base face CNC machined post-forge for flatness ±0.05 mm. Omnidirectional airflow compatibility — pins perform equally well with any airflow direction.
Al1100 · Al6061 · Al6063Get Quote
Materials: Cu C110 · OFHC Cu · Al6061 · Al6063 · Al1100 (cold forge)
Request All 3 →
Computer, CPU & SSD Heat Sinks
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Computer CPU coolers, standalone CPU heat sinks, and M.2 SSD heat sink clips for computing platforms — custom and prototype quantities where standard retail coolers do not fit the enclosure, mounting standard, or performance requirement. Custom CPU cooler bases with IHS contact geometry, copper heat pipe groove, and custom retention mounting pattern. SSD heat sinks with M.2 2280/2242 clip geometry and thermal interface pad recess.
THM-012
CPU & SSD / 012 — FEATURED
Computer CPU Coolers
Custom CNC machined CPU tower coolers and low-profile coolers for standard and non-standard CPU socket layouts — LGA1700, AM5, custom embedded processor modules, and FPGA development boards. Copper base with heat pipe groove (3 mm, 6 mm, or 8 mm heat pipe) CNC machined for direct contact heat pipe layout. IHS (integrated heat spreader) contact face lapped to Ra ≤0.1 μm for minimum thermal resistance. Aluminium fin stack bonded to heat pipe or direct-touch heat pipe configuration. Custom retention mounting bracket pattern for non-standard socket PCBs. Fan mount boss pattern for 40 mm to 120 mm fan attachment.
Cu C110 Base + Al6063 Fin Stack
Get Quote
THM-013
CPU & SSD / 013
CPU Heat Sinks
Direct-contact CPU heat sinks without heat pipe — for low-to-medium TDP processors (up to ~65 W) in embedded, industrial, and fan-cooled system-on-module applications. Custom footprint matching processor package size. Base contact face lapped to Ra ≤0.2 μm. Mounting stud pattern for custom carrier boards.
Al6061 · Al6063 · Cu · Al+CuGet Quote
THM-014
CPU & SSD / 014
SSD Heat Sinks
M.2 NVMe SSD heat sink clips for 2280 and 2242 form factors. CNC machined aluminium upper and lower plates with spring-clip retention. Thermal interface pad recess 0.5 mm deep for 0.5 mm silicone pad. Custom SSD format (non-standard embedded or industrial SSD) heat sinks from drawing. Black anodize standard for thermal emissivity. PCIe add-in card SSD bracket heat sink versions available.
Al6061 · Al6063 · Cu InsertGet Quote
Materials: Cu C110 · Al6061 · Al6063 · Composite Cu+Al
Request All 3 →
Manufacturing & Material Capability
Thermal Conductivity by Material
& Key Manufacturing Capabilities
♨
Thermal Conductivity Comparison (W/m·K)
Cu C110
401 W/m·K
Al-SiC
150–250 W/m·K
Al6063
209 W/m·K
Al6061
167 W/m·K
Al5052
138 W/m·K
SS304
16 W/m·K
SS304 shown for reference — not a heat sink material. Copper is 2.4× more conductive than Al6061. Al6063 is the best-conducting aluminium alloy for heat sinks.
🌡
Base Flatness — the Single Biggest Thermal Variable
The thermal interface between heat source and heat sink base is the largest contributor to thermal resistance in the system — more than fin surface area or material choice. We machine and verify base contact face flatness to ±0.005–0.05 mm depending on application. Copper bases for premium applications are lapped to Ra ≤0.1 μm. Not mentioned in most heat sink specifications because most manufacturers don't measure it. We do.
±0.005mm cold plates±0.05mm LED/finRa ≤0.1μm copper
⚙
Skived Fin — 0.5 mm Fin, 0.5 mm Gap, 10× Density
Skived fin process shaves thin fins from a solid aluminium base using a precision blade — achieving 0.5 mm fin thickness at 0.5 mm gap pitch (1 mm total pitch). CNC milling cannot achieve this — minimum milled fin is ~1 mm limited by end mill diameter and deflection. Higher fin density means significantly higher surface area in the same footprint — lower thermal resistance for natural and low-velocity forced convection applications.
0.5mm fin thickness0.5mm gap10× CNC density
💧
Cold Plate Pressure Test — Certified Per Piece
Every liquid cold plate hydraulically pressure tested at 1.5× working pressure (15 bar for 10 bar WP rating) with individual test certificate. Leak is identified before you install the part in your system. No exceptions — all cold plates shipped with test certificate, not available on request.
1.5× WP testIndividual certNo exceptions
🔨
Cold Forging — Pin Array Impossible by CNC
Cold forging achieves 1.5 mm pin diameter at 3 mm pitch — 5–10× the fin density achievable by CNC milling. Cold forging also improves aluminium thermal conductivity along the pin axis by 10–15% by aligning grain structure. For omnidirectional pin arrays where airflow direction is unpredictable, cold-forged pin-fin heat sinks outperform milled straight-fin at equivalent footprint.
1.5mm pin dia.10× density+15% conductivity
🎨
Black Anodize — Surface Emissivity from 0.05 to 0.86
Bare polished aluminium has emissivity ε ≈ 0.05 — essentially invisible to infrared radiation. Black anodize raises emissivity to ε ≈ 0.86 — increasing radiated heat transfer by ~17× in natural convection applications. For a passive heat sink in still air, black anodize can reduce thermal resistance by 15–25% compared to bare aluminium at the same geometry. We specify black anodize on all passive cooling heat sinks unless the customer specifies otherwise.
ε 0.05 bare Alε 0.86 black anodize−15–25% Rth
Precision Specifications
Tolerances & Performance Standards — Heat Sink Parts
📐
Dimensional Tolerances by Feature
Cold Plate Base
±0.005 mm
Cu Base (lapped)
±0.003 mm
Power Module Base
±0.005 mm
LED Mount Face
±0.05 mm
Gen. Heat Sink Base
±0.05 mm
Fin Min Thickness (CNC)
1.0 mm
Fin Min Thickness (Skived)
0.5 mm
Cold Plate WP
10 bar std.
🌡
Thermal Performance Specs
Cu Conductivity
401 W/m·K
Best available thermal conductivity — C110 / OFHC copper. 2.4× Al6061.
Al6063 Conductivity
209 W/m·K
Best aluminium alloy for heat sinks. Best anodize quality.
Black Anodize ε
0.86
Surface emissivity. Bare aluminium ε ≈ 0.05. Radiated flux 17× increase.
Cold Plate Test
15 bar
1.5× WP (10 bar WP). Individual hydraulic test certificate per piece.
Cold Forge Pin
1.5 mm dia.
Min pin diameter. 3 mm pitch. 10× density vs CNC milled fin.
Skived Fin
0.5 mm
Min fin thickness and gap. 1 mm pitch. Impossible by CNC milling.
Surface Treatments
Surface Finishes for Maximum Thermal Performance
Surface treatment choice directly affects thermal resistance — not just appearance. We advise on treatment selection for each application.
🎨
Black Anodize (Type II)
ε ≈ 0.86 for maximum radiated heat transfer. 15–25% lower Rth vs bare Al in natural convection. Standard on all passive cooling heat sinks. Apply to fin surfaces only or entire part.
Passive CoolingLED
🔩
Hard Anodize Type III
25–75 μm oxide layer. Hardness 400–600 HV for wear-resistant base surfaces and mounting holes. Slightly lower ε than Type II. Used on heat sinks requiring dimensional stability under repeated assembly/disassembly.
IndustrialWear
✦
Clear / Natural Anodize
Aluminium natural appearance. ε ≈ 0.70–0.80 (much higher than bare). Used where silver appearance is required — optical reflector-adjacent surfaces and visible luminaire components where black appearance is undesirable.
LuminaireVisible
💎
Nickel Plating (Cu)
Electroless nickel on copper heat sinks and cold plates. Prevents copper oxidation, enables soldering of heat source directly to heat sink base, and improves corrosion resistance. 3–5 μm thin — negligible thermal resistance addition.
Copper HSSolderable
💧
Electroless Nickel (Al)
Electroless nickel on aluminium cold plates for corrosive coolant compatibility (ethylene glycol/water, DI water) — aluminium is susceptible to galvanic corrosion and pitting in EG/W coolant loops without treatment. 25 μm EN coating standard.
Cold PlatesEG/Water
🔲
Graphene / Thermal Spray
Graphene coating or thermal spray of high-conductivity ceramic (BeO, AlN) on aluminium base for improved through-plane conductivity. Specialist treatment for extreme heat flux applications — laser diode bars, GaN amplifiers. Quote on application.
High FluxSpecialist
Production Workflow
From Drawing to Thermally Verified Heat Sink
01
Thermal DFM
Fin geometry, material selection, and base flatness spec confirmed. 24hr quotation.
02
CNC Machining
Fin array milled. Base face finish-machined at controlled depth-of-cut for flatness.
03
Base Lapping
Copper and precision bases lapped to ±0.003 mm and Ra ≤0.1 μm. CMM flatness verified.
04
Pressure Test
Cold plates hydraulic tested at 1.5× WP. Individual serial number cert issued.
05
Surface Treatment
Black anodize, clear anodize, nickel plate, or EN applied. Emissivity target confirmed.
06
Inspection & Delivery
Base flatness verified. Pressure cert (cold plates) + CMM report enclosed.
Our Advantage
Why Thermal Engineers Specify Our Heat Sinks
Flat
Base Flatness Measured — Not Assumed
The base contact face is the single most important heat sink dimension — yet most manufacturers never measure it. We machine and verify every base face flatness to specification: ±0.005 mm cold plates, ±0.05 mm LED and fin heat sinks. Copper bases lapped to Ra ≤0.1 μm. Measured before anodize, not after.
ε 0.86
Black Anodize — Always Specified for Passive Cooling
We specify black anodize on all passive cooling heat sinks as default — not as an option. Emissivity ε = 0.86 vs bare aluminium ε = 0.05 means 17× more radiated heat transfer. In natural convection, this reduces thermal resistance by 15–25%. An overlooked specification that costs nothing and matters enormously.
15 bar
Cold Plate Test Cert — Every Piece, No Exceptions
Every cold plate pressure tested at 15 bar (1.5× 10 bar working pressure). Individual serial number. Certificate shipped with the part. Not available on request — included as standard. A liquid-cooled system that leaks after installation is a catastrophic failure. We prevent it.
0.5mm
Skived Fin — 0.5 mm Where CNC Stops at 1 mm
CNC milling minimum fin thickness is ~1 mm (limited by end mill diameter and deflection). Skived fin achieves 0.5 mm fin at 0.5 mm gap — 1 mm pitch total. 10× the fin count in the same footprint. For natural convection applications where every cm² of surface matters, skived fin is the answer CNC milling cannot provide.
Get a Quote
Send Your Drawing.
Get a Quote.
Every enquiry includes a DFM review — tolerance feasibility, material confirmation, and process approach confirmed before production starts. MOQ 1 piece.
24hr
Quote Response
MOQ 1
Prototypes OK
ISO
9001:2015
📐
DFM Review on Every Enquiry
Tolerance feasibility, fixturing strategy, and material confirmation. Specific, actionable feedback — not generic pushback.
🎯
First Article Inspection — Standard
FAI report on every new run. Material certs and surface treatment certs included with every shipment.
🔄
Same Process: Prototype to Production
Process plan from your prototype applies to production batches. No re-qualification when you scale.
⚙
3 / 4 / 5-Axis CNC + Turning
Complex structural parts, shafts, housings, and transmission components. Metals and engineering plastics.
ISO 9001:2015
3/4/5-Axis Milling
CNC Turning
CMM Inspection
Global Delivery