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Product Category
<1×10⁻⁹ · EP Ra 0.4µm · O-Ring ±0.02 · Bakeable
VMF / 001 — 008

CNC Machined
Vacuum Manifolds

Precision CNC machined vacuum manifolds — ultra-clean electropolished internal surfaces, O-ring groove dimensions to seal manufacturer specification, leak rate <1×10⁻⁹ mbar·l/s. SUS316L or Al 6061 for semiconductor, laboratory, and research vacuum systems.

<10⁻⁹
He Leak
Ra 0.4µm
EP Internal
KF/CF/VCR
Standards
PART DWG · VMF-000 6-PORT MANIFOLD · SUS316L EP ISO 9001 · BAKEABLE 300°C
Electropolished EP
6 KF/CF Ports
P1 P2 P3 (PUMP) P4 (GAUGE) P5 P6 SUS316L EP O-RING · GROOVE W ±0.02 AS568/BS1806 W ±0.02 mm Depth ±0.02 mm ✓ 25-30% squeeze ✓ CMM verified ELECTROPOLISH · EP MACHINED Ra 1.6 ✗ EP ◀ Ra 0.4 ✓ OUTGAS 5-10× LOWER CLEAN · 5-STEP Degrease + chip removal IPA ultrasonic 15min N₂ blow-dry UV lamp inspect ISO Class 5 cleanroom double-seal bag + N₂ purge MATERIAL · BASE PRESSURE MATERIAL P min CLASS SUS316L EP ◀ 10⁻¹⁰ UHV SUS316L 10⁻⁹ HV SUS304 10⁻⁸ HV Al 6061 HA 10⁻⁶ MV · light Al 6082 10⁻⁵ budget MV SCALE 1 : 3 · MM
Semi · Research · UHV · Optical · Med · Cryo
Use Cases
SUS316L EP · 304 · Al 6061 · Al 6082
Materials
48hr Quote · 7-Day Proto
Service
<1×10⁻⁹
Leak Rate
mbar·l/s helium test
Ra 0.4µm
Internal Surface
electropolished
KF/CF/VCR
Flange Standards
supported
7 Days
Fastest Delivery
prototype orders
Machining Challenges

Vacuum Manifold Machining Challenges

A vacuum manifold must achieve leak rates undetectable by standard pressure testing — requiring electropolished surfaces, precision O-ring grooves, and a cleanroom-compatible manufacturing process.

💨
Ultra-Low Leak Rate
Vacuum manifolds for semiconductor or research applications require leak rates <1×10⁻⁹ mbar·l/s. This demands defect-free sealing surfaces, precise O-ring groove geometry, and helium leak testing — not just pneumatic pressure testing.
🧼
Surface Cleanliness & Outgassing
Internal surfaces must be free of machining residues, oils, and micro-roughness that outgas in high vacuum. HXC electropolishes internal surfaces and ultrasonically cleans in IPA before cleanroom packaging.
Flange & Port Interface Accuracy
KF, CF, and VCR interface dimensions are standardised — any deviation causes flange face misalignment and leaks at the knife-edge seal. HXC machines all vacuum flange faces to ISO/PNEUROP standards and verifies by CMM.
Our Work

Vacuum Manifolds We've Made

High-vacuum manifolds for semiconductor, research, and laboratory systems — helium leak tested.

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Vacuum Manifold Batch
Capabilities & Tolerances

What We Can Deliver

Typical specifications for this product type. Confirm exact requirements at enquiry.

Leak rate standard<1×10⁻⁹ mbar·l/s
Internal Ra0.4 µm (electropolished)
Flange standardsKF (ISO), CF (ConFlat), VCR, ISO-K
O-ring groove tolerance±0.02 mm depth/width
CleaningIPA ultrasonic + cleanroom pack
Helium leak testStandard on all vacuum manifolds
MaterialsSUS316L, Al 6061, Al 6082
ElectropolishInternal surfaces standard
CertificationHelium leak test certificate
Lead time (proto)7–10 days
Lead time (batch)12–18 days
PackagingCleanroom bag, double-sealed
How It Works

From Drawing to Finished Part

Upload your drawing — DFM review, machining, pressure/leak test if required, and shipping within agreed lead time.

01
Upload Drawing
STEP, DXF, PDF. Include channel specs, thread standards, and sealing requirements.
02
DFM & Quote
Free DFM review — channel access, deburring feasibility, sealing surface strategy. Quote in 48 h.
03
Machine & Test
CNC machining, deburring, cleaning, CMM inspection, pressure/leak test as specified.
04
Ship Worldwide
Inspection report + test records enclosed. DHL / FedEx / sea freight.
Reviews

Trusted by Engineers Worldwide

★★★★★
"Deep cross-drilled channels were deburred perfectly — zero burrs found at our incoming inspection. Leak test passed first time. Delivery exactly on schedule."
MK
Martin K.
Hydraulic Systems Engineer · Germany
★★★★★
"We source precision valve bodies and manifold blocks from HXC. Bore coaxiality is consistently within 0.005 mm, sealing surface Ra verified on every batch."
SL
Sophie L.
Procurement Manager · France
★★★★★
"HXC understood the cleanliness requirements for our semiconductor gas distribution plates immediately. Documentation package was complete and traceable."
JT
James T.
Process Engineer · Taiwan
FAQ

Frequently Asked Questions About Vacuum Manifold Machining

Engineering and procurement questions answered by our team.

Standard: <1×10⁻⁹ mbar·l/s (helium leak test). For UHV applications: <1×10⁻¹⁰ mbar·l/s with additional surface treatment and knife-edge CF flanges. Every vacuum manifold HXC produces is helium leak tested and a test certificate with date, instrument calibration reference, and measured leak rate is provided.
HXC machines all standard vacuum interface flanges: KF (Klein Flange, ISO 2861) — Ø10 to Ø160 mm; CF (ConFlat, ANSI/BSR) — knife-edge sealing for UHV; ISO-K / ISO-F — large-diameter vacuum; VCR — high-purity gas and vacuum tubing fittings. All flange face dimensions are machined to ISO/PNEUROP standard and verified by CMM.
HXC electropolishes all internal surfaces of vacuum manifolds: Ra 0.4 µm after electropolishing (vs Ra 0.8–1.6 µm machined). Electropolishing removes surface asperities and chromium-depleted layer, reducing outgassing rate by 5–10× compared to machined-only surfaces. Essential for systems where base pressure below 10⁻⁷ mbar is required.
(1) Degreasing and machining residue removal; (2) Ultrasonic cleaning in IPA; (3) Nitrogen blow-dry; (4) Visual inspection under UV light for residual contamination; (5) Double-sealed cleanroom packaging in ISO Class 5 bag. Particle count report available on request for semiconductor-grade manifolds.
O-ring groove dimensions for CF and KF flanges follow AS568 / BS1806 standard grove geometry. Critical tolerances: groove width ±0.02 mm; groove depth ±0.02 mm; groove centreline position ±0.05 mm relative to flange face. These tolerances ensure the O-ring is compressed to the correct percentage for leak-free sealing. All groove dimensions are CMM-verified.
Yes — for UHV applications (base pressure <10⁻⁹ mbar): (1) CF ConFlat flanges with knife-edge sealing (copper or gold-coated gasket); (2) electropolished interior Ra 0.4 µm; (3) UHV-compatible materials (SUS316L, non-magnetic grades on request); (4) bake-out capable — machined from 316L with no trapped volumes. Helium leak test to <1×10⁻¹⁰ mbar·l/s available.
SUS316L: standard for high and ultra-high vacuum — low outgassing, electropolishable, non-magnetic (standard grade). Al 6061/6082: for lower-vacuum systems (< 10⁻⁶ mbar) where weight matters — KF flanges, hard anodized. SUS304: for medium vacuum and clean process systems. Material mill certificates and RoHS compliance provided.
Prototype: 7–10 days (includes electropolish + helium leak test). Small batch (5–20 pcs): 12–18 days. Production: 16–24 days. UHV ConFlat manifolds: add 2–3 days.
Get a Quote

Send Your Drawing.
Get a Quote.

Every enquiry includes a DFM review — tolerance feasibility, material confirmation, and process approach confirmed before production starts. MOQ 1 piece.

24hr
Quote Response
MOQ 1
Prototypes OK
ISO
9001:2015
📐
DFM Review on Every Enquiry
Tolerance feasibility, fixturing strategy, and material confirmation. Specific, actionable feedback — not generic pushback.
🎯
First Article Inspection — Standard
FAI report on every new run. Material certs and surface treatment certs included with every shipment.
🔄
Same Process: Prototype to Production
Process plan from your prototype applies to production batches. No re-qualification when you scale.
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