Catégorie de produit
CUP — 18 Product Lines
Cuivre
CNC
Machined Parts
18 product lines in C110 ETP copper, C101/C102 oxygen-free copper, and CrZrCu — conductive blocks, busbars, electrodes, heat sinks, terminals, battery strips, transformer parts, and semiconductor equipment components. Tin, nickel, and silver plating. Thermal interface lapping Ra ≤0.1 μm.
Electrical Conductivity by Copper Grade (% IACS)
C101/C102 OFC≥100%
C110 ETP≥99,9%
CrZrCu≥80%
Laiton C360~28%
Al 6061~43%
IACS = International Annealed Copper Standard. 100% IACS = 58.0 MS/m resistivity.
≥99,9%
IACS C110
385 W/m·K
Thermal λ
18
Gamme de produits
≥99.9%
IACS C110
385 W/m·K
Conductivité thermique
Ra ≤0.1μm
Thermal Interface
24hr
Délai de devis
Bloc Conducteur ✦
Busbar Part ✦
EDM Electrode ✦
Welding Electrode ✦
Heat Sink Block ✦
Heat Sink Plate ✦
Conductive Terminal ✦
Battery Connection Strip ✦
Transformer Part ✦
Thermal Mounting Seat ✦
HF Conductive Part ✦
Ground Terminal ✦
Induction Coil Body ✦
Semiconductor Part ✦
Bloc Conducteur ✦
Busbar Part ✦
EDM Electrode ✦
Welding Electrode ✦
Heat Sink Block ✦
Heat Sink Plate ✦
Conductive Terminal ✦
Battery Connection Strip ✦
Transformer Part ✦
Thermal Mounting Seat ✦
HF Conductive Part ✦
Ground Terminal ✦
Induction Coil Body ✦
Semiconductor Part ✦
Gammes de produits complètes
18 Copper Parts Across
4 Product Categories
Select a category tab · C110 · C101/C102 OFC · CrZrCu · W-Cu · Tin/Ni/Ag Plating · MOQ 1 piece
Electrical Conductive PartsDevis →
Seven C110 ETP copper electrical conductive parts — conductive blocks, fittings, terminals, busbars, busbar connectors, ground terminals, and power distribution parts. C110 conductivity ≥99.9% IACS — the maximum practical conductivity for machined parts. All parts tin-plated (3–10μm) as standard to prevent oxide formation that increases contact resistance. Nickel and silver plating available. Hole patterns and threads inspected go/no-go.
CUP-001→007
ELECTRICAL / 001–007 — CATEGORY OVERVIEW
C110 ETP Copper Electrical Conductive Parts
Complete range of C110 ETP copper electrical conductive parts for power distribution and electrical connection systems. Conductive blocks (face flatness ±0.01mm, conductivity ≥99.9% IACS), conductive fittings (threaded NPT/BSP interface, current-rated contact face), conductive terminals (crimp or bolt interface, tin/silver plated), machined busbar bodies (hole pattern ±0.05mm, drilled and tapped, tin or nickel plated), busbar connectors and branch-off bodies (multi-hole, custom geometry), ground terminals (face flatness ±0.02mm, tin plated per IEC 60079-14), and power distribution copper parts (any geometry, drilled and tapped). All parts tin-plated 3–10μm as standard — prevents copper oxide formation that causes contact resistance increase in service. Nickel plating for bolted connections in industrial environments; silver plating for high-cycle contact surfaces requiring minimum contact resistance. Material certificate (ASTM B152) available. Conductivity verified by eddy current method on request.
C110 ETP · C102 OFCObtenir un devis
CUP-001/002
ELECTRICAL / 001–002
Conductive Blocks & Fittings
C110 conductive blocks (face flatness ±0.01mm, Ra ≤0.4μm, tin or silver plated) and threaded conductive fittings (NPT/BSP/G thread, current-rated contact face, tin plated). Custom profiles to drawing. Conductivity ≥99.9% IACS.
C110 ETP · C102 OFCObtenir un devis
CUP-005/006/007
ELECTRICAL / 005–007
Busbars, Ground Terminals & Power Parts
C110 machined busbar bodies (hole pattern ±0.05mm, drilled and tapped), ground terminals (face ±0.02mm, IEC 60079-14 tin plated), and power distribution copper parts (any geometry). All tin or nickel plated. Thread go/no-go inspected.
C110 ETP · C101 OFCObtenir un devis
Matériaux : C110 ETP · C101 OFC · C102 OFC (ASTM B170)
Request All 7 →
Thermal & Heat Sink PartsDevis →
Four C110 copper thermal management parts — heat sink blocks, heat sink spreader plates, thermal interface mounting seats, and induction equipment copper bodies. C110 thermal conductivity 385 W/m·K — 3× better than aluminium 6061 (167 W/m·K). Thermal mounting seat base lapped to ±0.005mm flatness and Ra ≤0.1μm — the surface quality required for minimum thermal interface resistance at semiconductor package contacts.
CUP-016
THERMAL / 016 — FEATURED
Thermal Interface Mounting Seats — Lapped
C110 precision copper thermal mounting blocks for power semiconductor modules (IGBT, MOSFET, SiC, GaN), laser diode packages, and DBC (direct bonded copper) substrate assembly. Thermal conductivity 385 W/m·K. Base flatness lapped to ±0.005mm — surface grinding alone achieves ±0.01mm which is insufficient for the pressure distribution required at semiconductor package interfaces. Ra ≤0.1μm base surface — reduces TIM (thermal interface material) layer thickness required for void-free contact, improving steady-state thermal resistance by 15–30% compared to a ground surface. Mounting hole pattern tolerance ±0.01mm for PCB alignment. Nickel plating 3–5μm on all surfaces for corrosion resistance and module solder/epoxy adhesion compatibility. C101 oxygen-free copper available for vacuum-compatible or hydrogen atmosphere applications. Thermal resistance improvement verified by measurement — documentary evidence available on request.
C110 ETP · C101 OFCObtenir un devis
CUP-008
THERMAL / 008
Heat Sink Blocks
C110 copper heat sink blocks with milled fins (min fin 0.5mm wide, 30mm tall) or skived ultra-thin fins (0.1–0.3mm). Base flatness ±0.01mm. 385 W/m·K — 3× better than Al6061. Tin or nickel plated. Custom profile to drawing.
C110 ETP · C101 OFCObtenir un devis
CUP-009
THERMAL / 009
Heat Sink Spreader Plates
C110/C1020 heat spreader plates for DBC substrate and power module assembly. Flatness ±0.01mm (±0.005mm lapped on request). Electroless nickel 3–5μm for substrate bonding compatibility; gold flash option for DBC Cu solder bonding. C101 OFC for vacuum applications.
C110 · C101 OFC · C1020Obtenir un devis
Matériaux : C110 ETP · C101/C102 OFC · C1020 · CrZrCu
Demandez tous les 4 →
HF, Transformer & Battery PartsDevis →
Four specialised C110 copper parts for high-frequency, transformer, battery, and electrical connector applications. HF and RF parts silver-plated ≥5μm — at high frequencies, current flows in the skin of the conductor (skin depth decreasing with frequency), so surface conductivity directly determines HF loss; silver is the highest-conductivity metal and minimises skin-effect resistance. Battery connection strips nickel-plated ≥5μm for lithium chemistry compatibility and corrosion resistance at cell terminal interfaces.
CUP-010
HF & BATTERY / 010 — FEATURED
High-Frequency Conductive Parts — Silver Plated
C110 copper parts silver-plated ≥5μm for RF, HF, and high-frequency power conversion applications (induction power supply, RF amplifier, resonant converter, and induction heating bus connections). The skin effect — where AC current concentrates in a surface layer whose depth decreases inversely with frequency — means that at 1 MHz skin depth in copper is only 66μm; all current flows in the outer surface layer. Silver plating (conductivity ~106% IACS, slightly higher than copper) on the current-carrying surface minimises skin-effect resistance. Geometry designed for minimum current path length and minimum skin-effect resistance: rounded corners instead of sharp angles that concentrate current; minimum cross-section transitions; integral cooling where joule heating is significant. Profile tolerance ±0.01mm for repeatable inductance and coupling geometry in resonant circuits. Base material C110 ETP or C101 OFC (for vacuum and hydrogen-atmosphere induction equipment). Silver plating thickness 5–25μm as specified — XRF thickness measurement available.
C110 ETP · C101 OFCObtenir un devis
CUP-011
HF & BATTERY / 011
Transformer Parts
C110 transformer winding forms, terminal blocks, and bus connection bodies. High conductivity ≥99.9% IACS. Silver or tin plated. Custom geometry to drawing. Bobbin former, terminal strip, and magnetic core interface machined integral.
C110 ETP · C101 OFCObtenir un devis
CUP-015
HF & BATTERY / 015
Battery Connection Strip Parts
C110/C1020 battery connection strips for lithium cell modules and EV battery packs. Hole pattern ±0.05mm for cell terminal alignment. Nickel plated ≥5μm for Li chemistry compatibility and cell terminal corrosion resistance. Ra ≤0.4μm. Laser or mechanical weld-tab geometry to drawing.
C110 ETP · C1020Obtenir un devis
CUP-012
HF & BATTERY / 012
Connecteurs électriques
C110/brass electrical connector bodies. Contact face Ra ≤0.4μm. Tin (solderability), nickel (wear), silver (low resistance), or gold flash (signal contact) plating. Custom body profile to drawing. Thread 6g; bore H7.
C110 · Brass C360Obtenir un devis
Matériaux : C110 ETP · C101 OFC · C1020 · Brass C360
Demandez tous les 4 →
Electrodes & Semiconductor PartsDevis →
Three specialised electrode and semiconductor equipment copper parts — CNC-milled EDM sinker electrodes in dense C110 copper or W-Cu, CrZrCu (RWMA Class 2) resistance welding electrodes, and C101/C102 oxygen-free copper conductive parts for semiconductor processing equipment. EDM electrode profile accuracy ±0.005mm. CrZrCu electrodes CNC-machined to all standard electrode face profiles. OFC semiconductor parts with conductivity ≥99.99% and vacuum compatibility.
CUP-004
ELECTRODES / 004 — FEATURED
CrZrCu Resistance Welding Electrodes
CrZrCu (chromium zirconium copper, RWMA Class 2) resistance spot welding electrodes — the standard material for production resistance welding of steel, stainless, and galvanised sheet. Hardness HRB 75–80 (approximately 3× harder than pure copper ETP at HRB 40–50) resists electrode face deformation during the 200–500kg forging force applied during spot welding. Conductivity ≥80% IACS passes welding current with minimal resistive heating of the electrode body. Face profiles machined to all ISO 5821 and AWS C1.1 standard styles: flat face (Type A), dome radius face (Type B), truncated cone (Type C), offset face, double-taper, and custom to drawing. Electrode shank dimensions to ISO 5184 (tapered) or custom straight shank. CNC face profiling accuracy ±0.05mm on face radius; face-to-shank concentricity ≤0.05mm. Electrode cap and shank available as assembled or separate. Face cap re-dresser grinding on return electrodes available.
CrZrCu · C18150 · AlMgSiCuObtenir un devis
CUP-003
ELECTRODES / 003
EDM Sinker Electrodes
CNC-milled EDM sinker electrodes in dense C110 copper or W-Cu (tungsten copper 70/30–80/20). Profile accuracy ±0.005mm. Ra ≤0.2μm. C110 for standard steel EDM; W-Cu for die steel and cemented carbide requiring lower electrode wear. Custom 3D profiles to drawing.
C110 · W-Cu 70/30 · W-Cu 80/20Obtenir un devis
Capacité de fabrication
What Copper Parts Require
Beyond Standard CNC Machining
⚡
Conductivity Verification — IACS Tested
Electrical conductivity verified by eddy current method on copper parts where conductivity is a specification (OFC semiconductor parts, welding electrodes). Conductivity in % IACS reported per piece. Confirms no inadvertent contamination from machining setup that could reduce conductivity below specification.
🔬
Thermal Interface Lapping — Ra ≤0.1μm
Thermal mounting block bases lapped after surface grinding — achieving flatness ±0.005mm and Ra ≤0.1μm. Lapping removes ground surface peaks that concentrate contact pressure on a small fraction of interface area. Critical for semiconductor module thermal resistance — a lapped copper base reduces required TIM thickness by 30–50%, directly improving junction temperature in operation.
🥇
Silver Plating ≥5μm — XRF Verified
Silver plating thickness measured by XRF spectrometry on HF and critical contact parts where plating thickness is a specification. Plating thickness ≥5μm confirmed per piece. At 1 MHz skin depth in silver is 63μm — 5μm plating thickness is sufficient to carry virtually all HF current on a flat or slightly curved surface at up to 100 MHz.
💧
Water-Cooled Channels — Leak Tested
Internal water-cooling channels machined in copper induction coil bodies and cold plate blocks. All channel cross-sections CMM-verified; assembled and leak-tested at 1.5× working pressure with test certificate. Blind-end pressure test with nitrogen to verify channel integrity before assembly. Brazing of channel cover plates performed in reducing atmosphere to preserve copper surface quality.
🔩
OFC — Hydrogen and Vacuum Compatible
C101/C102 oxygen-free copper parts for semiconductor vacuum and reducing atmosphere processing. OFC contains <0.001% oxygen — eliminates hydrogen embrittlement (hydrogen disease) that affects ETP copper at elevated temperatures. Machined surfaces cleaned and packaged to semiconductor industry cleanliness standards on request. ASTM B170 Grade 1 material certificate.
🛡
Tin Plating — Oxide Prevention Standard
Copper forms copper oxide (Cu₂O) on surfaces within days in air — increasing contact resistance from near-zero to 0.1–10mΩ at low contact force. Tin plating 3–10μm prevents oxide formation, provides solderable surface, and is RoHS compliant. Standard on all copper electrical parts — not an optional extra. Applied after final machining and deburring.
Spécifications de précision
Tolerances & Material Reference — Copper Parts
📐
Tolérances par Fonctionnalité
Face Flat (block)
±0,01 mm
Thermal Lapped
±0,005 mm
Hole Pattern
±0,05 mm
Turned OD
h7 / h6
EDM Electrode
±0,005 mm
Surface (lapped)
Ra ≤0.1 μm
Surface (turned)
Ra ≤0,4 μm
Thread Class
6H / 6g
⚡
Material & Conductivity Reference
C110 ETP Conductivity
≥99.9% IACS
Standard for busbars, terminals, conductive blocks. ASTM B152. Best cost-conductivity ratio.
C101 OFC
≥100% IACS
Oxygen-free. Hydrogen-safe at elevated temp. Semiconductor / vacuum applications. ASTM B170.
CrZrCu Hardness
HRB 75–80
RWMA Class 2. Welding electrodes and induction coil formers. ≥80% IACS conductivity maintained.
Thermal λ (C110)
385 W/m·K
3× better than Al6061 (167 W/m·K). Copper heat sinks mandatory for high-power density applications.
Ag Plate (HF)
≥5 μm
Skin depth 63μm at 1MHz. ≥5μm silver carries essentially all surface current at <100MHz.
Sn Plate (std)
3–10 μm
Prevents copper oxide contact resistance rise. RoHS compliant. Standard on all electrical copper parts.
Traitements de surface
Plating & Finishing for Copper Parts
Surface treatment of copper parts prevents oxide formation, maintains conductivity, and ensures solderability — all critical for electrical reliability in service.
🥈
Tin Plating (3–10μm)
Bright or matte tin, electroplated. Standard for all copper electrical parts — prevents Cu₂O formation that increases contact resistance. Solderable. RoHS compliant. 3μm for light-duty indoor; 10μm for harsh environment. Hot-dip tin for heavy busbar bodies.
All busbar / terminalStandard
🔘
Nickel Plating (3–10μm)
Electrolytic bright nickel. Harder than tin — better wear resistance for bolted connections. Good corrosion resistance in industrial environments. Required for lithium battery connection strips and EV busbars. Nickel barrier recommended under gold for connector bodies.
Battery stripsEV busbars
🥇
Silver Plating (5–25μm)
Highest conductivity of metallic platings (~106% IACS). Best for HF parts (skin effect), high-cycle contact surfaces, and bus bars in high-reliability power electronics. XRF thickness measurement on request. Applied over copper or over thin nickel strike.
HF / RF partsPower busbars
✨
Gold Flash (0.1–0.5μm over Ni)
Gold flash over 2–5μm nickel for signal connector bodies and precision contact surfaces requiring minimum and stable contact resistance over millions of mating cycles. Gold prevents nickel oxide formation at contact interface. XRF verified on critical connector orders.
Signal contactsConnecteurs
💧
Electroless Nickel (3–5μm)
Uniform electroless nickel for DBC substrate heat spreader plates — controlled thickness ±0.5μm for substrate bonding compatibility. Better uniformity than electrolytic nickel on complex 3D surfaces. Can be applied to OFC copper for vacuum-compatible parts where electroplating is problematic.
DBC heat spreadersUniform thickness
🌟
Passivation / Lacquer
Benzotriazole (BTA) passivation for copper parts where plating would add unacceptable thickness or affect conductivity. Inhibits copper oxide formation for 12–24 months of ambient storage. Anti-tarnish lacquer for cosmetic copper parts where appearance matters. Both options remove easily before assembly if clean contact is required.
Storage protectionCosmetic parts
Flux de production
De dessin à Plated, Tested Copper Part
01
Revue DFM
Grade (ETP vs OFC), plating spec, lapping requirement, and conductivity test scope confirmed. 24hr.
02
Matériau
C110 ETP or C101/C102 OFC received with ASTM B152/B170 material certificate. Grade confirmed.
03
Usinage CNC
Turned, milled, drilled, tapped. Sharp tools, controlled parameters to avoid copper burring and smear.
04
Grind / Lap
Face grinding ±0.01mm; lapping ±0.005mm / Ra ≤0.1μm for thermal mounting seats and heat spreaders.
05
Galvanoplastie
Tin / Ni / Ag / Au plating to spec. XRF thickness on critical orders. Plating certificate included.
06
Test & Deliver
Conductivity test (eddy current) on OFC and CrZrCu parts. Inspection report + mat cert + plate cert enclosed.
Notre Avantage
Pourquoi les ingénieurs spécifient nos Copper Parts
Sn
Tin Plating Standard — Not Optional
Every copper electrical part tin-plated as standard — copper oxide forms within days in air and increases contact resistance from near-zero to measurable levels. We never ship bare copper electrical parts. Tin plating is a functional requirement, not a cosmetic upgrade, and is included in every electrical copper part price without special request.
OFC
OFC for Semiconductor — ASTM B170
C101/C102 oxygen-free copper (ASTM B170 Grade 1/2) specified for semiconductor equipment parts — not substituted with cheaper C110 ETP. The oxygen content difference (0.001% vs 0.04%) is invisible to a metallurgist examining the part but becomes a catastrophic failure mode when the part is brazed or cycled in hydrogen atmosphere during semiconductor fab processing.
Lisser
Thermal Lapping Ra ≤0.1μm — Not Just Ground
Thermal mounting blocks for IGBT modules lapped to Ra ≤0.1μm — not claimed as Ra ≤0.1μm from surface grinding alone (which achieves Ra ≤0.4μm standard). The difference determines TIM layer thickness requirement and steady-state thermal resistance at the semiconductor interface. We document the Ra by profilometer measurement, not process assumption.
Ag
Silver Plate XRF Verified — HF Applications
Silver plating thickness ≥5μm XRF-measured for HF parts where skin depth at operating frequency determines minimum required plating thickness. A nominal 5μm plating specification without XRF verification can deliver 2μm actual thickness from process variation — insufficient to carry surface current at frequencies above ~10 MHz. We measure and document the plating thickness.
Foire aux questions
Copper CNC Parts — Questions fréquentes
Technical questions about copper grades, plating, oxygen-free copper, thermal interface, and welding electrodes.
C110 ETP (≥99.9% IACS, ASTM B152): standard for busbars, terminals, conductive blocks — best cost-conductivity combination. C101/C102 OFC (≥100% IACS, ASTM B170): oxygen-free, for semiconductor equipment, vacuum, and hydrogen atmosphere applications. CrZrCu (≥80% IACS, HRB 75–80, RWMA Class 2): resistance welding electrodes and induction coil formers requiring both conductivity and hardness. W-Cu (70/30–80/20): EDM electrodes in demanding die steel applications. C172 BeCu: spring contact elements requiring high strength + moderate conductivity.
Tin (3–10μm): standard for all copper electrical parts — prevents oxide, solderable, RoHS. Nickel (3–10μm): harder than tin, for bolted connections and EV battery strips — Li chemistry compatible. Silver (5–25μm): highest conductivity for HF/RF parts and high-cycle contacts — XRF verified on request. Gold flash (0.1–0.5μm over Ni): signal connector contacts. Electroless nickel (3–5μm): for DBC heat spreader plates — uniform thickness critical for substrate bonding. All plating with plating certificate.
Oxygen-free copper (OFC, C101/C102, ASTM B170) contains <0.001% oxygen vs 0.02–0.04% in C110 ETP. Same conductivity — both ≥99.9% IACS. The difference: in hydrogen or reducing atmosphere at elevated temperature, hydrogen reacts with copper oxide inclusions in ETP copper to form steam, causing blistering and mechanical failure ('hydrogen disease'). Specify OFC for: parts brazed in hydrogen furnace, vacuum-brazed cooling assemblies, semiconductor equipment parts that cycle in hydrogen or inert atmosphere, and e-beam or ion source components. ETP C110 is adequate for all ambient-temperature and normal soldering applications.
Thermal mounting blocks for IGBT and semiconductor packages require flatness ±0.005mm and Ra ≤0.1μm — achieved by lapping after surface grinding. Surface grinding achieves ±0.01mm and Ra ≤0.4μm — inadequate for critical thermal contact. Lapping removes surface peaks that concentrate pressure on a small fraction of the interface area — reducing required TIM thickness and improving thermal resistance by 15–30%. Ra measured by profilometer and documented. Surface grinding alone does not achieve Ra ≤0.1μm in copper.
CrZrCu (chromium zirconium copper, RWMA Class 2) is the standard resistance spot welding electrode material. HRB 75–80 hardness (3× C110) resists electrode face deformation under 200–500kg welding force; ≥80% IACS conductivity passes welding current with minimal self-heating. Pure copper mushrooms after a few hundred welds — CrZrCu lasts 3,000–5,000 welds before re-dressing. We machine all ISO 5821 face profiles (flat, dome, truncated cone, offset) and ISO 5184 shanks, plus custom to drawing.
Yes. C110 copper heat sink blocks (385 W/m·K, 3× Al6061 167 W/m·K) with milled fins (0.5mm min width, 30mm max height) or skived ultra-thin fins (0.1–0.3mm). For DBC heat spreader plates: base flatness ±0.005mm lapped, Ra ≤0.1μm, electroless nickel 3–5μm for substrate bonding. For semiconductor packages: C101 OFC, vacuum compatible, Ra ≤0.1μm lapped base. Liquid-cooled cold plates with internal micro-channels pressure-tested at 1.5× working pressure with certificate.
Turned OD: h7 (±0.01–0.02mm) standard; h6 for precision parts. Drilled hole pattern: ±0,05mm for busbar patterns; ±0,01mm for precision locating features. Flatness: ±0,01mm surface ground; ±0,005mm lapped. Surface finish: Ra ≤0,4 μm turned standard; Ra ≤0,1μm lapped. EDM electrode profile: ±0,005mm. Thread: 6H/6g standard. Copper is soft — requires sharp tooling and controlled parameters to avoid burring and smear at fine tolerances.
MOQ : 1 pièce. Standard lead times: simple turned/milled parts without plating: 3–7 working days. Parts with electroplating (Sn/Ni/Ag): add 3–5 working days. Precision lapped thermal blocks: 5–10 working days. Complex parts (induction coil formers, cold plates): 7–14 working days. W-Cu EDM electrodes: 5–10 working days. Production 50+ pieces: quoted individually. ASTM B152/B170 material certificate available for all copper grades.
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Obtenir un devis
Envoyez votre dessin.
Obtenez un devis.
Chaque demande comprend une revue DFM — faisabilité des tolérances, confirmation du matériau et approche du processus avant le début de la production. MOQ 1 pièce.
24hr
Réponse au devis
Quantité Minimum de Commande 1
Prototypes OK
ISO
9001:2015
📐
Revue DFM sur chaque demande
Faisabilité des tolérances, stratégie de fixation et confirmation des matériaux. Retour spécifique et exploitable — pas de refus générique.
🎯
Inspection du premier article — Standard
Rapport FAI sur chaque nouvelle série. Certificats de matériaux et de traitement de surface inclus avec chaque expédition.
🔄
Même processus : Prototype à Production
Le plan de processus de votre prototype s'applique aux lots de production. Pas de requalification lors de la montée en gamme.
⚙
Usinage CNC 3 / 4 / 5 axes + tournage
Pièces structurelles complexes, arbres, boîtiers et composants de transmission. Métaux et plastiques d'ingénierie.
ISO 9001:2015
Fraisage 3/4/5 axes
Tournage CNC
Inspection CMM
Livraison mondiale