What copper grades do you use for electrical conductive parts?

We machine five main copper grades for electrical applications. C110 (ETP copper, electrolytic tough pitch): conductivity ≥99.9% IACS, the standard grade for busbars, terminals, conductive blocks, and power distribution parts — best combination of conductivity, machinability, and cost. C101/C102 (oxygen-free copper, OFC): conductivity ≥100% IACS, no oxygen content to prevent hydrogen embrittlement in brazing and welding operations — specified for semiconductor equipment parts, vacuum-compatible components, and parts requiring hydrogen atmosphere processing. CrZrCu (chromium zirconium copper, RWMA Class 2): conductivity ≥80% IACS with hardness HRB 75–80 — the standard for resistance welding electrodes and induction equipment parts requiring both electrical conductivity and mechanical strength. W-Cu (tungsten copper, 70/30 to 80/20): high hardness, excellent arc-erosion resistance — used for EDM electrodes in demanding die steel applications. For heat sink applications, C110 provides the highest thermal conductivity (385 W/m·K) of practical machined copper grades.

What plating options are available for copper machined parts?

Tin plating (3–10μm, bright or matte): most common for copper electrical parts — prevents copper oxide formation that increases contact resistance, provides solderable surface, and is RoHS compliant. Applied hot-dip or electroplated. Nickel plating (3–10μm): harder than tin, better wear resistance for bolted connections, good corrosion resistance in industrial environments. Required for lithium battery connection strips and EV applications. Silver plating (5–25μm): best electrical conductivity and lowest contact resistance — specified for RF/HF parts where skin effect demands maximum surface conductivity, and for high-cycle contact surfaces. Gold flash (0.1–0.5μm over nickel): for low-force signal contact terminals. Nickel strike + silver: standard for bus bars in high-reliability power electronics. All plating applied to specified thickness — XRF measured on request for critical parts.

What is oxygen-free copper and when should I specify it?

Oxygen-free copper (OFC, C101/C102, ASTM B170 Grade 1/2) contains less than 0.001% oxygen, compared to 0.02–0.04% oxygen in standard ETP copper (C110). The oxygen in ETP copper exists as copper oxide inclusions — these do not affect conductivity (both grades are ≥99.9% IACS) but cause a critical problem in reducing atmosphere processing: at elevated temperatures, hydrogen diffuses into the copper and reacts with the oxygen to form steam, which nucleates as bubbles at grain boundaries ('hydrogen disease') — causing blistering, porosity, and mechanical failure. Specify OFC for: parts that will be brazed, soldered in hydrogen furnace, or vacuum-annealed; vacuum equipment components (vacuum brazed cooling assemblies, e-beam and ion source parts); semiconductor process equipment copper parts that must survive multiple thermal cycles in hydrogen or inert atmosphere. Standard ETP C110 is adequate for all ambient-temperature and normal soldering applications.

How do you achieve flatness for thermal interface copper mounting blocks?

Thermal mounting blocks for IGBT modules, power semiconductors, and laser diode packages require base flatness ±0.005mm and surface finish Ra ≤0.1μm — both critical for minimising thermal interface resistance. The flatness and surface finish are achieved by lapping (fixed abrasive or free abrasive against a reference flat), not by surface grinding alone. Surface grinding achieves flatness ±0.01mm and Ra ≤0.4μm — inadequate for critical thermal contact. Lapping achieves flatness ±0.005mm and Ra ≤0.1μm by removing the surface peaks that concentrate contact pressure on a small fraction of the interface area. Thermal grease or TIM (thermal interface material) performance depends heavily on the surface condition of the copper base — a Ra ≤0.1μm lapped copper surface reduces TIM layer thickness required and improves steady-state thermal resistance by 15–30% compared to a ground surface.

What are CrZrCu welding electrodes and why are they used for resistance welding?

CrZrCu (chromium zirconium copper) is the RWMA (Resistance Welding Manufacturers Alliance) Class 2 electrode material — the standard for resistance spot welding electrodes and seam welding wheels. It contains approximately 0.6–1.2% chromium and 0.03–0.25% zirconium. These precipitation-hardening additions provide hardness HRB 75–80 (approximately HRC 15–20) while maintaining conductivity ≥80% IACS. The hardness resists mechanical deformation of the electrode face during the forging force applied during spot welding. The conductivity ensures the welding current passes efficiently through the electrode without excessive resistive heating. Pure copper (C110) is too soft — it mushrooms and deforms at the electrode tip after a few hundred welds. CrZrCu maintains face geometry for 3000–5000 welds before re-dressing, typically 5–10× more than pure copper electrodes. We machine all standard electrode face profiles: flat face, radius face, truncated cone, offset, and custom to drawing.

Can you machine copper heat sinks for power electronics?

Yes — we machine C110 copper heat sink blocks and spreader plates for power electronics cooling. Base flatness ±0.01mm standard, ±0.005mm lapped for direct semiconductor substrate bonding. Fin geometries by milling (minimum fin width 0.5mm, height 30mm with W:H 1:15), skiving (ultra-thin fins 0.1–0.3mm thickness for maximum surface area), or micro-channel milling (internal water channels for liquid-cooled cold plates). For DBC (direct bonded copper) substrate heat spreader plates: base flatness ±0.005mm, surface Ra ≤0.1μm lapped, nickel plating 3–5μm for substrate bonding compatibility. For laser diode and semiconductor package heat spreaders: C101 oxygen-free copper for vacuum-compatible applications. Plating options: electroless nickel, silver, gold flash over nickel. Thermal conductivity: C110 at 385 W/m·K — approximately 3× better than aluminium 6061 (167 W/m·K) for the same geometry.

What tolerances can you achieve on copper CNC parts?

Copper is soft and ductile — it machines cleanly but requires sharp tools and controlled parameters to avoid burring and surface smear. Achievable tolerances: turned OD h7/h8 (±0.01–0.02mm) standard; h6 for precision turned copper parts. Drilled and tapped holes: position tolerance ±0.05mm for busbar hole patterns (standard connector spacing), ±0.01mm for precision locating features. Flatness: ±0.01mm by surface grinding, ±0.005mm by lapping. Surface finish: Ra ≤0.4μm turned standard; Ra ≤0.2μm fine turned; Ra ≤0.1μm lapped for thermal interfaces. Thread quality: 6H/6g standard; 4H/4h for precision terminal threads. Electrode profile tolerance: ±0.005mm for EDM electrodes (CNC milled in very hard copper or W-Cu).

What is MOQ and lead time for copper machined parts?

Minimum order quantity is 1 piece for custom copper parts. Standard lead times: simple turned and milled parts (conductive blocks, terminals, fittings) without plating: 3–7 working days. Parts requiring electroplating (tin, nickel, silver): add 3–5 working days. Precision lapped thermal blocks: 5–10 working days. Complex parts (induction coil formers, water-cooled cold plates): 7–14 working days. EDM electrodes in W-Cu: 5–10 working days (W-Cu is significantly harder to machine than pure copper). For production quantities of 50+ pieces, volume pricing and lead times quoted individually. Material certificates (ASTM B152/B170 or equivalent) available for all copper grades.

Acasă/ Produse/ Piese prelucrate CNC din cupru

Categorie Produs

CUP — 18 Product Lines

Cupru
CNC
Machined Parts

18 product lines in C110 ETP copper, C101/C102 oxygen-free copper, and CrZrCu — conductive blocks, busbars, electrodes, heat sinks, terminals, battery strips, transformer parts, and semiconductor equipment components. Tin, nickel, and silver plating. Thermal interface lapping Ra ≤0.1 μm.

Electrical Conductivity by Copper Grade (% IACS)

C101/C102 OFC

≥100%

C110 ETP

≥99.9%

CrZrCu

≥80%

Alama C360

~28%

Al 6061

~43%

IACS = International Annealed Copper Standard. 100% IACS = 58.0 MS/m resistivity.

Solicită o ofertă → Trimite desenul

Copper CNC Parts Busbars Terminals Electrodes Heat Sinks

≥99.9%

IACS C110

Copper Conductive Block Terminal Heat Sink CNC

385 W/m·K

Thermal λ

Game de produse

≥99.9^%

IACS C110

385^W/m·K

Conductivitate termică

Ra ≤0.1^μm

Thermal Interface

24^hr

Timp de răspuns pentru ofertă

Bloc conductiv ✦ Busbar Part ✦ EDM Electrode ✦ Welding Electrode ✦ Bloc de răcire ✦ Heat Sink Plate ✦ Terminal conductiv ✦ Battery Connection Strip ✦ Transformer Part ✦ Thermal Mounting Seat ✦ HF Conductive Part ✦ Ground Terminal ✦ Induction Coil Body ✦ Semiconductor Part ✦ Bloc conductiv ✦ Busbar Part ✦ EDM Electrode ✦ Welding Electrode ✦ Bloc de răcire ✦ Heat Sink Plate ✦ Terminal conductiv ✦ Battery Connection Strip ✦ Transformer Part ✦ Thermal Mounting Seat ✦ HF Conductive Part ✦ Ground Terminal ✦ Induction Coil Body ✦ Semiconductor Part ✦

Gama completă de produse

18 Copper Parts Across
4 Product Categories

Select a category tab · C110 · C101/C102 OFC · CrZrCu · W-Cu · Tin/Ni/Ag Plating · MOQ 1 piece

Solicitați Toate Produsele →

Categorii de produse

Seven C110 ETP copper electrical conductive parts — conductive blocks, fittings, terminals, busbars, busbar connectors, ground terminals, and power distribution parts. C110 conductivity ≥99.9% IACS — the maximum practical conductivity for machined parts. All parts tin-plated (3–10μm) as standard to prevent oxide formation that increases contact resistance. Nickel and silver plating available. Hole patterns and threads inspected go/no-go.

C110 Copper Busbar Part Conductive Block Terminal Power Distribution CNC Tin Plated

CUP-001→007

ELECTRICAL / 001–007 — CATEGORY OVERVIEW

C110 ETP Copper Electrical Conductive Parts

Complete range of C110 ETP copper electrical conductive parts for power distribution and electrical connection systems. Conductive blocks (face flatness ±0.01mm, conductivity ≥99.9% IACS), conductive fittings (threaded NPT/BSP interface, current-rated contact face), conductive terminals (crimp or bolt interface, tin/silver plated), machined busbar bodies (hole pattern ±0.05mm, drilled and tapped, tin or nickel plated), busbar connectors and branch-off bodies (multi-hole, custom geometry), ground terminals (face flatness ±0.02mm, tin plated per IEC 60079-14), and power distribution copper parts (any geometry, drilled and tapped). All parts tin-plated 3–10μm as standard — prevents copper oxide formation that causes contact resistance increase in service. Nickel plating for bolted connections in industrial environments; silver plating for high-cycle contact surfaces requiring minimum contact resistance. Material certificate (ASTM B152) available. Conductivity verified by eddy current method on request.

C110 ≥99.9% IACS Tin plate 3–10μm Face flat ±0.01mm ASTM B152 cert

C110 ETP · C102 OFCSolicită ofertă

C110 Conductive Block Fitting Face Ground Tin Plated CNC

CUP-001/002

ELECTRICAL / 001–002

Conductive Blocks & Fittings

C110 conductive blocks (face flatness ±0.01mm, Ra ≤0.4μm, tin or silver plated) and threaded conductive fittings (NPT/BSP/G thread, current-rated contact face, tin plated). Custom profiles to drawing. Conductivity ≥99.9% IACS.

±0.01mm flatNPT/BSP/G

C110 ETP · C102 OFCSolicită ofertă

C110 Copper Busbar Machined Hole Pattern Tin Nickel Plated CNC

CUP-005/006/007

ELECTRICAL / 005–007

Busbars, Ground Terminals & Power Parts

C110 machined busbar bodies (hole pattern ±0.05mm, drilled and tapped), ground terminals (face ±0.02mm, IEC 60079-14 tin plated), and power distribution copper parts (any geometry). All tin or nickel plated. Thread go/no-go inspected.

Pattern ±0.05mmIEC 60079-14

C110 ETP · C101 OFCSolicită ofertă

Materiale: C110 ETP · C101 OFC · C102 OFC (ASTM B170)

Request All 7 →

Four C110 copper thermal management parts — heat sink blocks, heat sink spreader plates, thermal interface mounting seats, and induction equipment copper bodies. C110 thermal conductivity 385 W/m·K — 3× better than aluminium 6061 (167 W/m·K). Thermal mounting seat base lapped to ±0.005mm flatness and Ra ≤0.1μm — the surface quality required for minimum thermal interface resistance at semiconductor package contacts.

C110 Copper Thermal Mounting Seat IGBT Laser Module DBC Lapped Ra ≤0.1μm Flatness ±0.005mm

CUP-016

THERMAL / 016 — FEATURED

Thermal Interface Mounting Seats — Lapped

C110 precision copper thermal mounting blocks for power semiconductor modules (IGBT, MOSFET, SiC, GaN), laser diode packages, and DBC (direct bonded copper) substrate assembly. Thermal conductivity 385 W/m·K. Base flatness lapped to ±0.005mm — surface grinding alone achieves ±0.01mm which is insufficient for the pressure distribution required at semiconductor package interfaces. Ra ≤0.1μm base surface — reduces TIM (thermal interface material) layer thickness required for void-free contact, improving steady-state thermal resistance by 15–30% compared to a ground surface. Mounting hole pattern tolerance ±0.01mm for PCB alignment. Nickel plating 3–5μm on all surfaces for corrosion resistance and module solder/epoxy adhesion compatibility. C101 oxygen-free copper available for vacuum-compatible or hydrogen atmosphere applications. Thermal resistance improvement verified by measurement — documentary evidence available on request.

Flatness ±0.005mm lapped Ra ≤0.1μm 385 W/m·K Ni plate compatible

C110 ETP · C101 OFCSolicită ofertă

C110 Copper Heat Sink Block Milled Fins Skived Fins Power Electronics

CUP-008

THERMAL / 008

Heat Sink Blocks

C110 copper heat sink blocks with milled fins (min fin 0.5mm wide, 30mm tall) or skived ultra-thin fins (0.1–0.3mm). Base flatness ±0.01mm. 385 W/m·K — 3× better than Al6061. Tin or nickel plated. Custom profile to drawing.

385 W/m·KFin from 0.1mm

C110 ETP · C101 OFCSolicită ofertă

C110 Copper Heat Sink Spreader Plate DBC Substrate Ni Au Plated

CUP-009

THERMAL / 009

Heat Sink Spreader Plates

C110/C1020 heat spreader plates for DBC substrate and power module assembly. Flatness ±0.01mm (±0.005mm lapped on request). Electroless nickel 3–5μm for substrate bonding compatibility; gold flash option for DBC Cu solder bonding. C101 OFC for vacuum applications.

DBC compatibleAu/Ni plated

C110 · C101 OFC · C1020Solicită ofertă

Materiale: C110 ETP · C101/C102 OFC · C1020 · CrZrCu

Solicită Toate 4 →

Four specialised C110 copper parts for high-frequency, transformer, battery, and electrical connector applications. HF and RF parts silver-plated ≥5μm — at high frequencies, current flows in the skin of the conductor (skin depth decreasing with frequency), so surface conductivity directly determines HF loss; silver is the highest-conductivity metal and minimises skin-effect resistance. Battery connection strips nickel-plated ≥5μm for lithium chemistry compatibility and corrosion resistance at cell terminal interfaces.

C110 Silver-Plated HF RF Conductive Part Skin Effect Copper CNC ≥5μm

CUP-010

HF & BATTERY / 010 — FEATURED

High-Frequency Conductive Parts — Silver Plated

C110 copper parts silver-plated ≥5μm for RF, HF, and high-frequency power conversion applications (induction power supply, RF amplifier, resonant converter, and induction heating bus connections). The skin effect — where AC current concentrates in a surface layer whose depth decreases inversely with frequency — means that at 1 MHz skin depth in copper is only 66μm; all current flows in the outer surface layer. Silver plating (conductivity ~106% IACS, slightly higher than copper) on the current-carrying surface minimises skin-effect resistance. Geometry designed for minimum current path length and minimum skin-effect resistance: rounded corners instead of sharp angles that concentrate current; minimum cross-section transitions; integral cooling where joule heating is significant. Profile tolerance ±0.01mm for repeatable inductance and coupling geometry in resonant circuits. Base material C110 ETP or C101 OFC (for vacuum and hydrogen-atmosphere induction equipment). Silver plating thickness 5–25μm as specified — XRF thickness measurement available.

Silver plate ≥5μm Skin effect optimised C110 / C101 OFC XRF thickness verify

C110 ETP · C101 OFCSolicită ofertă

C110 Transformer Winding Form Terminal Block Tin Silver Copper CNC

CUP-011

HF & BATTERY / 011

Transformer Parts

C110 transformer winding forms, terminal blocks, and bus connection bodies. High conductivity ≥99.9% IACS. Silver or tin plated. Custom geometry to drawing. Bobbin former, terminal strip, and magnetic core interface machined integral.

Silver / tin plate

C110 ETP · C101 OFCSolicită ofertă

C110 Battery Connection Strip Nickel Plated Hole Pattern EV Lithium CNC

CUP-015

HF & BATTERY / 015

Battery Connection Strip Parts

C110/C1020 battery connection strips for lithium cell modules and EV battery packs. Hole pattern ±0.05mm for cell terminal alignment. Nickel plated ≥5μm for Li chemistry compatibility and cell terminal corrosion resistance. Ra ≤0.4μm. Laser or mechanical weld-tab geometry to drawing.

Ni plate ≥5μmLi cell compatible

C110 ETP · C1020Solicită ofertă

C110 Copper Electrical Connector Body Contact Face Tin Gold Plated CNC

CUP-012

HF & BATTERY / 012

Conectori electrici

C110/brass electrical connector bodies. Contact face Ra ≤0.4μm. Tin (solderability), nickel (wear), silver (low resistance), or gold flash (signal contact) plating. Custom body profile to drawing. Thread 6g; bore H7.

Gold / Ag / Sn / Ni

C110 · Brass C360Solicită ofertă

Materiale: C110 ETP · C101 OFC · C1020 · Brass C360

Solicită Toate 4 →

Three specialised electrode and semiconductor equipment copper parts — CNC-milled EDM sinker electrodes in dense C110 copper or W-Cu, CrZrCu (RWMA Class 2) resistance welding electrodes, and C101/C102 oxygen-free copper conductive parts for semiconductor processing equipment. EDM electrode profile accuracy ±0.005mm. CrZrCu electrodes CNC-machined to all standard electrode face profiles. OFC semiconductor parts with conductivity ≥99.99% and vacuum compatibility.

CUP-004

ELECTRODES / 004 — FEATURED

CrZrCu Resistance Welding Electrodes

CrZrCu (chromium zirconium copper, RWMA Class 2) resistance spot welding electrodes — the standard material for production resistance welding of steel, stainless, and galvanised sheet. Hardness HRB 75–80 (approximately 3× harder than pure copper ETP at HRB 40–50) resists electrode face deformation during the 200–500kg forging force applied during spot welding. Conductivity ≥80% IACS passes welding current with minimal resistive heating of the electrode body. Face profiles machined to all ISO 5821 and AWS C1.1 standard styles: flat face (Type A), dome radius face (Type B), truncated cone (Type C), offset face, double-taper, and custom to drawing. Electrode shank dimensions to ISO 5184 (tapered) or custom straight shank. CNC face profiling accuracy ±0.05mm on face radius; face-to-shank concentricity ≤0.05mm. Electrode cap and shank available as assembled or separate. Face cap re-dresser grinding on return electrodes available.

CrZrCu RWMA Class 2 HRB 75–80 ≥80% IACS ISO 5821 / AWS C1.1

CrZrCu · C18150 · AlMgSiCuSolicită ofertă

CUP-003

ELECTRODES / 003

EDM Sinker Electrodes

CNC-milled EDM sinker electrodes in dense C110 copper or W-Cu (tungsten copper 70/30–80/20). Profile accuracy ±0.005mm. Ra ≤0.2μm. C110 for standard steel EDM; W-Cu for die steel and cemented carbide requiring lower electrode wear. Custom 3D profiles to drawing.

Profile ±0.005mmW-Cu option

C110 · W-Cu 70/30 · W-Cu 80/20Solicită ofertă

Capacități de fabricație

What Copper Parts Require
Beyond Standard CNC Machining

⚡

Conductivity Verification — IACS Tested

Electrical conductivity verified by eddy current method on copper parts where conductivity is a specification (OFC semiconductor parts, welding electrodes). Conductivity in % IACS reported per piece. Confirms no inadvertent contamination from machining setup that could reduce conductivity below specification.

Eddy current test% IACS reported

🔬

Thermal Interface Lapping — Ra ≤0.1μm

Thermal mounting block bases lapped after surface grinding — achieving flatness ±0.005mm and Ra ≤0.1μm. Lapping removes ground surface peaks that concentrate contact pressure on a small fraction of interface area. Critical for semiconductor module thermal resistance — a lapped copper base reduces required TIM thickness by 30–50%, directly improving junction temperature in operation.

±0.005mm lappedRa ≤0.1μm

🥇

Silver Plating ≥5μm — XRF Verified

Silver plating thickness measured by XRF spectrometry on HF and critical contact parts where plating thickness is a specification. Plating thickness ≥5μm confirmed per piece. At 1 MHz skin depth in silver is 63μm — 5μm plating thickness is sufficient to carry virtually all HF current on a flat or slightly curved surface at up to 100 MHz.

XRF measured≥5μm silver

💧

Water-Cooled Channels — Leak Tested

Internal water-cooling channels machined in copper induction coil bodies and cold plate blocks. All channel cross-sections CMM-verified; assembled and leak-tested at 1.5× working pressure with test certificate. Blind-end pressure test with nitrogen to verify channel integrity before assembly. Brazing of channel cover plates performed in reducing atmosphere to preserve copper surface quality.

Leak tested 1.5×WPCMM channel

🔩

OFC — Hydrogen and Vacuum Compatible

C101/C102 oxygen-free copper parts for semiconductor vacuum and reducing atmosphere processing. OFC contains <0.001% oxygen — eliminates hydrogen embrittlement (hydrogen disease) that affects ETP copper at elevated temperatures. Machined surfaces cleaned and packaged to semiconductor industry cleanliness standards on request. ASTM B170 Grade 1 material certificate.

C101 OFCASTM B170Vacuum grade

🛡

Tin Plating — Oxide Prevention Standard

Copper forms copper oxide (Cu₂O) on surfaces within days in air — increasing contact resistance from near-zero to 0.1–10mΩ at low contact force. Tin plating 3–10μm prevents oxide formation, provides solderable surface, and is RoHS compliant. Standard on all copper electrical parts — not an optional extra. Applied after final machining and deburring.

3–10μm SnOxide preventionRoHS

Specificații de precizie

Tolerances & Material Reference — Copper Parts

📐

Toleranțe după caracteristică

Face Flat (block)

±0.01 mm

Thermal Lapped

±0.005 mm

Hole Pattern

±0,05 mm

Turned OD

h7 / h6

EDM Electrode

±0.005 mm

Surface (lapped)

Ra ≤0.1 μm

Surface (turned)

Ra ≤0,4 μm

Thread Class

6H / 6g

⚡

Material & Conductivity Reference

C110 ETP Conductivity

≥99.9^{% IACS}

Standard for busbars, terminals, conductive blocks. ASTM B152. Best cost-conductivity ratio.

C101 OFC

≥100^{% IACS}

Oxygen-free. Hydrogen-safe at elevated temp. Semiconductor / vacuum applications. ASTM B170.

CrZrCu Hardness

HRB 75–80

RWMA Class 2. Welding electrodes and induction coil formers. ≥80% IACS conductivity maintained.

Thermal λ (C110)

385^W/m·K

3× better than Al6061 (167 W/m·K). Copper heat sinks mandatory for high-power density applications.

Ag Plate (HF)

≥5 μm

Skin depth 63μm at 1MHz. ≥5μm silver carries essentially all surface current at <100MHz.

Sn Plate (std)

3–10 μm

Prevents copper oxide contact resistance rise. RoHS compliant. Standard on all electrical copper parts.

Tratament de suprafață

Plating & Finishing for Copper Parts

Surface treatment of copper parts prevents oxide formation, maintains conductivity, and ensures solderability — all critical for electrical reliability in service.

🥈

Tin Plating (3–10μm)

Bright or matte tin, electroplated. Standard for all copper electrical parts — prevents Cu₂O formation that increases contact resistance. Solderable. RoHS compliant. 3μm for light-duty indoor; 10μm for harsh environment. Hot-dip tin for heavy busbar bodies.

All busbar / terminalStandard

🔘

Nickel Plating (3–10μm)

Electrolytic bright nickel. Harder than tin — better wear resistance for bolted connections. Good corrosion resistance in industrial environments. Required for lithium battery connection strips and EV busbars. Nickel barrier recommended under gold for connector bodies.

Battery stripsEV busbars

🥇

Silver Plating (5–25μm)

Highest conductivity of metallic platings (~106% IACS). Best for HF parts (skin effect), high-cycle contact surfaces, and bus bars in high-reliability power electronics. XRF thickness measurement on request. Applied over copper or over thin nickel strike.

HF / RF partsPower busbars

✨

Gold Flash (0.1–0.5μm over Ni)

Gold flash over 2–5μm nickel for signal connector bodies and precision contact surfaces requiring minimum and stable contact resistance over millions of mating cycles. Gold prevents nickel oxide formation at contact interface. XRF verified on critical connector orders.

Signal contactsConectori

💧

Electroless Nickel (3–5μm)

Uniform electroless nickel for DBC substrate heat spreader plates — controlled thickness ±0.5μm for substrate bonding compatibility. Better uniformity than electrolytic nickel on complex 3D surfaces. Can be applied to OFC copper for vacuum-compatible parts where electroplating is problematic.

DBC heat spreadersUniform thickness

🌟

Passivation / Lacquer

Benzotriazole (BTA) passivation for copper parts where plating would add unacceptable thickness or affect conductivity. Inhibits copper oxide formation for 12–24 months of ambient storage. Anti-tarnish lacquer for cosmetic copper parts where appearance matters. Both options remove easily before assembly if clean contact is required.

Storage protectionCosmetic parts

Flux de lucru pentru producție

De la desen la Plated, Tested Copper Part

Revizuire DFM

Grade (ETP vs OFC), plating spec, lapping requirement, and conductivity test scope confirmed. 24hr.

Material

C110 ETP or C101/C102 OFC received with ASTM B152/B170 material certificate. Grade confirmed.

Prelucrare CNC

Turned, milled, drilled, tapped. Sharp tools, controlled parameters to avoid copper burring and smear.

Grind / Lap

Face grinding ±0.01mm; lapping ±0.005mm / Ra ≤0.1μm for thermal mounting seats and heat spreaders.

Placare

Tin / Ni / Ag / Au plating to spec. XRF thickness on critical orders. Plating certificate included.

Test & Deliver

Conductivity test (eddy current) on OFC and CrZrCu parts. Inspection report + mat cert + plate cert enclosed.

Avantajul nostru

De ce inginerii specifică ale noastre Copper Parts

Tin Plating Standard — Not Optional

Every copper electrical part tin-plated as standard — copper oxide forms within days in air and increases contact resistance from near-zero to measurable levels. We never ship bare copper electrical parts. Tin plating is a functional requirement, not a cosmetic upgrade, and is included in every electrical copper part price without special request.

OFC

OFC for Semiconductor — ASTM B170

C101/C102 oxygen-free copper (ASTM B170 Grade 1/2) specified for semiconductor equipment parts — not substituted with cheaper C110 ETP. The oxygen content difference (0.001% vs 0.04%) is invisible to a metallurgist examining the part but becomes a catastrophic failure mode when the part is brazed or cycled in hydrogen atmosphere during semiconductor fab processing.

Lăcuire

Thermal Lapping Ra ≤0.1μm — Not Just Ground

Thermal mounting blocks for IGBT modules lapped to Ra ≤0.1μm — not claimed as Ra ≤0.1μm from surface grinding alone (which achieves Ra ≤0.4μm standard). The difference determines TIM layer thickness requirement and steady-state thermal resistance at the semiconductor interface. We document the Ra by profilometer measurement, not process assumption.

Silver Plate XRF Verified — HF Applications

Silver plating thickness ≥5μm XRF-measured for HF parts where skin depth at operating frequency determines minimum required plating thickness. A nominal 5μm plating specification without XRF verification can deliver 2μm actual thickness from process variation — insufficient to carry surface current at frequencies above ~10 MHz. We measure and document the plating thickness.

Întrebări frecvente

Copper CNC Parts — Întrebări frecvente

Technical questions about copper grades, plating, oxygen-free copper, thermal interface, and welding electrodes.

C110 ETP (≥99.9% IACS, ASTM B152): standard for busbars, terminals, conductive blocks — best cost-conductivity combination. C101/C102 OFC (≥100% IACS, ASTM B170): oxygen-free, for semiconductor equipment, vacuum, and hydrogen atmosphere applications. CrZrCu (≥80% IACS, HRB 75–80, RWMA Class 2): resistance welding electrodes and induction coil formers requiring both conductivity and hardness. W-Cu (70/30–80/20): EDM electrodes in demanding die steel applications. C172 BeCu: spring contact elements requiring high strength + moderate conductivity.

Tin (3–10μm): standard for all copper electrical parts — prevents oxide, solderable, RoHS. Nickel (3–10μm): harder than tin, for bolted connections and EV battery strips — Li chemistry compatible. Silver (5–25μm): highest conductivity for HF/RF parts and high-cycle contacts — XRF verified on request. Gold flash (0.1–0.5μm over Ni): signal connector contacts. Electroless nickel (3–5μm): for DBC heat spreader plates — uniform thickness critical for substrate bonding. All plating with plating certificate.

Oxygen-free copper (OFC, C101/C102, ASTM B170) contains <0.001% oxygen vs 0.02–0.04% in C110 ETP. Same conductivity — both ≥99.9% IACS. The difference: in hydrogen or reducing atmosphere at elevated temperature, hydrogen reacts with copper oxide inclusions in ETP copper to form steam, causing blistering and mechanical failure ('hydrogen disease'). Specify OFC for: parts brazed in hydrogen furnace, vacuum-brazed cooling assemblies, semiconductor equipment parts that cycle in hydrogen or inert atmosphere, and e-beam or ion source components. ETP C110 is adequate for all ambient-temperature and normal soldering applications.

Thermal mounting blocks for IGBT and semiconductor packages require flatness ±0.005mm and Ra ≤0.1μm — achieved by lapping after surface grinding. Surface grinding achieves ±0.01mm and Ra ≤0.4μm — inadequate for critical thermal contact. Lapping removes surface peaks that concentrate pressure on a small fraction of the interface area — reducing required TIM thickness and improving thermal resistance by 15–30%. Ra measured by profilometer and documented. Surface grinding alone does not achieve Ra ≤0.1μm in copper.

CrZrCu (chromium zirconium copper, RWMA Class 2) is the standard resistance spot welding electrode material. HRB 75–80 hardness (3× C110) resists electrode face deformation under 200–500kg welding force; ≥80% IACS conductivity passes welding current with minimal self-heating. Pure copper mushrooms after a few hundred welds — CrZrCu lasts 3,000–5,000 welds before re-dressing. We machine all ISO 5821 face profiles (flat, dome, truncated cone, offset) and ISO 5184 shanks, plus custom to drawing.

Yes. C110 copper heat sink blocks (385 W/m·K, 3× Al6061 167 W/m·K) with milled fins (0.5mm min width, 30mm max height) or skived ultra-thin fins (0.1–0.3mm). For DBC heat spreader plates: base flatness ±0.005mm lapped, Ra ≤0.1μm, electroless nickel 3–5μm for substrate bonding. For semiconductor packages: C101 OFC, vacuum compatible, Ra ≤0.1μm lapped base. Liquid-cooled cold plates with internal micro-channels pressure-tested at 1.5× working pressure with certificate.

Turned OD: h7 (±0.01–0.02mm) standard; h6 for precision parts. Drilled hole pattern: ±0.05mm for busbar patterns; ±0.01mm for precision locating features. Flatness: ±0.01mm surface ground; ±0.005mm lapped. Surface finish: Ra ≤0.4μm turned standard; Ra ≤0.1μm lapped. EDM electrode profile: ±0.005mm. Thread: 6H/6g standard. Copper is soft — requires sharp tooling and controlled parameters to avoid burring and smear at fine tolerances.

MOQ: 1 piesă. Standard lead times: simple turned/milled parts without plating: 3–7 working days. Parts with electroplating (Sn/Ni/Ag): add 3–5 working days. Precision lapped thermal blocks: 5–10 working days. Complex parts (induction coil formers, cold plates): 7–14 working days. W-Cu EDM electrodes: 5–10 working days. Production 50+ pieces: quoted individually. ASTM B152/B170 material certificate available for all copper grades.

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CupruCNCMachined Parts

18 Copper Parts Across4 Product Categories

What Copper Parts RequireBeyond Standard CNC Machining

Tolerances & Material Reference — Copper Parts

Plating & Finishing for Copper Parts

De la desen la Plated, Tested Copper Part

De ce inginerii specifică ale noastre Copper Parts

Copper CNC Parts — Întrebări frecvente

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Cupru
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Machined Parts

18 Copper Parts Across
4 Product Categories

What Copper Parts Require
Beyond Standard CNC Machining

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